IP Library Granted Patent US 9,852,786
Granted Patent B2
US 9,852,786 · App. 15/066,944 · Granted Dec 26, 2017

Semiconductor memory device that varies voltage levels depending on which of different memory regions thereof is accessed

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Quick Facts
Patent No.
US 9,852,786
App. No.
15/066,944
Granted
Dec 26, 2017
Kind
B2
Abstract

A semiconductor memory device includes a semiconductor memory chip including a plurality of regions of memory cells, including a first memory region and a second memory region, and a memory controller configured to carry out a read of a memory cell in the first memory region by applying a first read voltage, and a read of a memory cell in the second memory region by applying a second read voltage that is different from the first read voltage.

Claims (45)

1. A semiconductor memory device, comprising:

a semiconductor memory chip including a plurality of regions of memory cells, including a first memory region and a second memory region; and

a memory controller configured to

set a first voltage based on a first number of times the first memory region has been accessed since a predetermined point of time and carry out an operation on memory cells of the first memory region by applying the first voltage, when the first number is more than a threshold number, and

set a second voltage that is different from the first voltage based on a period of time that has passed since a last access to the second memory region and carry out the operation on memory cells of the second memory region by applying the second voltage, when a second number of times the second memory region has been accessed since the predetermined point of time is less than the threshold number.

2. The semiconductor memory device according to claim 1 , wherein

the semiconductor memory chip is a NAND memory chip, and

the first and second memory regions each correspond to one or more blocks of the semiconductor memory chip.

3. The semiconductor memory device according to claim 1 , wherein

the semiconductor memory chip is a NAND memory chip, and

the first memory region corresponds to one or more pages in a block of the semiconductor memory chip, and the second memory region corresponds to one or more pages in the block of the semiconductor memory chip.

4. The semiconductor memory device according to claim 1 , wherein the operation is a read operation.

5. The semiconductor memory device according to claim 1 , wherein the operation is a write operation.

6. The semiconductor memory device according to claim 1 , wherein the operation is an erase operation.

7. The semiconductor memory device according to claim 1 , wherein

the first and second voltages are applied to at least one of bit lines that are connected to the memory cells of the first and second memory regions, respectively.

8. The semiconductor memory device according to claim 1 , wherein

the first and second voltages are applied to at least one of word lines that are connected to the memory cells of the first and second memory regions, respectively.

9. A semiconductor memory device, comprising:

a semiconductor memory chip including a plurality of regions of memory cells, including a first memory region and a second memory region; and

a memory controller configured to

set a first voltage based on a first period of time that has passed since a last access to the first memory region and carry out an operation on memory cells of the first memory region by applying the first voltage, when a first number of times the first memory region has been accessed since the predetermined point of time is less than a threshold number, and

set a second voltage that is different from the first voltage based on a second period of time that has passed since a last access to the second memory region and carry out the operation on memory cells of the second memory region by applying the second voltage, when a second number of times the second memory region has been accessed since the predetermined point of time is less than the threshold number.

10. The semiconductor memory device according to claim 9 , wherein

the semiconductor memory chip is a NAND memory chip, and

the first and second memory regions each correspond to one or more blocks of the semiconductor memory chip.

11. The semiconductor memory device according to claim 9 , wherein

the semiconductor memory chip is a NAND memory chip, and

the first memory region corresponds to one or more pages in a block of the semiconductor memory chip, and the second memory region corresponds to one or more pages in the block of the semiconductor memory chip.

12. The semiconductor memory device according to claim 9 , wherein the operation is a read operation.

13. The semiconductor memory device according to claim 9 , wherein the operation is a write operation.

14. The semiconductor memory device according to claim 9 , wherein the operation is an erase operation.

15. The semiconductor memory device according to claim 9 , wherein

the first and second voltages are applied to at least one of bit lines that are connected to the memory cells of the first and second memory regions, respectively.

16. The semiconductor memory device according to claim 9 , wherein

the first and second voltages are applied to at least one of word lines that are connected to the memory cells of the first and second memory regions, respectively.

17. A semiconductor memory device, comprising:

a semiconductor memory chip including a plurality of regions of memory cells, including a first memory region and a second memory region; and

a memory controller configured to:

set a first voltage based on a number of error bits included in data read from the first memory region and perform an erase operation on memory cells of the first memory region by applying the first voltage, and

set a second voltage that is different from the first voltage based on a number of error bits included in data read from the second memory region and perform the erase operation on memory cells of the second memory region by applying the second voltage.

18. The semiconductor memory device according to claim 17 , wherein

the memory controller sets the first voltage further based on a first number of times the first memory region has been accessed since a predetermined point of time when the first number is more than a threshold number, and sets the second voltage further based on a period of time that has passed since a last access to the second memory region, when a second number of times the second memory region has been accessed since the predetermined point of time is less than the threshold number.

19. The semiconductor memory device according to claim 17 , wherein

the memory controller sets the first voltage further based on a first period of time that has passed since a last access to the first memory region, when a first number of times the first memory region has been accessed since the predetermined point of time is less than a threshold number, and sets the second voltage further based on a second period of time that has passed since a last access to the second memory region, when a second number of times the second memory region has been accessed since the predetermined point of time is less than the threshold number.

Assignments (5)
MERGER Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043194/0647 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2016
From: TAKIZAWA, KAZUTAKA; NIIJIMA, MASAAKI
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 038592/0654 →