Multi-block sputtering target and associated methods and articles
View Patent ↗A sputtering target that includes at least two consolidated blocks, each block including an alloy including molybdenum in an amount greater than about 30 percent by weight and at least one additional alloying ingredient; and a joint between the at least two consolidated blocks, the joint being free of any microstructure due to an added bonding agent (e.g., powder, foil or otherwise), and being essentially free of any visible joint line the target that is greater than about 200 μm width (e.g., less than about 50 μm width). A process for making the target includes hot isostatically pressing, below a temperature of 1080° C., consolidated perform blocks that may be surface prepared (e.g., roughened to a predetermined roughness value) prior to pressing.
1. A sputtering target, comprising:
a) at least two consolidated blocks, each block including an alloy including molybdenum in an amount greater than about 30 percent by weight and at least one additional alloying element; and
b) a joint between the at least two consolidated blocks, which joins the blocks together to define a target body, the joint being free of any microstructure due to an added bonding agent, and being essentially free of any joint line of greater than about 300 μm width, wherein the sputtering target at the joint exhibits a transverse rupture strength per ASTM B528-10, of at least 800 MPa.
2. The sputtering target of claim 1 , wherein the consolidated joint is essentially free of any joint line greater than 200 μm width and provides a structure that has a transverse rupture strength per ASTM B528-10, of at least 900 MPa at the joint.
3. The sputtering target of claim 2 , wherein at least one alloying element selected from titanium, chromium, niobium, tantalum, tungsten, zirconium, hafnium, vanadium lithium, sodium, potassium or any combination thereof.
4. The sputtering target of claim 1 , wherein the at least two consolidated blocks include a first block and a second block, and the consolidated joint includes a direct contact between a prepared surface of first block with a prepared surface of the second block.
5. The sputtering target of claim 4 , wherein the prepared surfaces are milled edges surfaces having an average surface roughness (Ra) of less than about 5.1 μm.
6. The sputtering target of claim 1 , wherein each of the consolidated blocks includes about 30 to about 70 at % molybdenum and the balance titanium, exclusive of impurities.
7. The sputtering target of claim 6 , wherein an oxygen weight of the sputtering target is between about 1000 ppm and 3500 ppm.
8. The sputtering target of claim 2 , wherein the target has a sputtering surface of at least about 1.5 m 2 , and the two or more consolidated blocks are joined end-to-end.
9. The sputtering target of claim 8 , wherein the sputtering target includes about 30 to about 70 at % molybdenum and the balance titanium, exclusive of impurities.
10. The sputtering target of claim 2 , wherein the prepared surfaces include edge surfaces that are milled to an average surface roughness (Ra) of less than about 3.8 μm to define opposing prepared surfaces for forming the contacted joint structure.