Granted Patent B2

US 9,975,194 · App. 15/067,779 · Granted May 22, 2018

Abstract

Claims (31)

1. A method of connecting two components by ultrasonic welding for producing a power semiconductor module, said method comprising the steps of:

a) aligning the components to be welded to form a welding interface;

b) aligning a welding tool to the aligned components;

c) removably arranging a trapping material at least partly encompassing the welding interface, whereby the trapping material is a foam; and

d) connecting the components by activating the welding tool,

wherein pockets of the foam are filled with an inert gas or with a surfactant.

2. The method according to claim 1 ,

wherein step c) further comprises removably arranging the trapping material at least partly encompassing the welding interface and in contact with the welding interface; and

wherein step d) further comprises connecting the components by activating the welding tool after removably arranging the foam trapping material.

3. The method according to claim 1 ,

wherein step c) further comprises removably arranging the trapping material at least partly encompassing the welding interface and in contact with at least one of the components,

wherein step c) is performed before step b).

4. The method according to claim 2 , wherein step c) is performed after step b).

5. The method according to claim 2 , wherein said method comprises the further step:

e) performing a cleaning procedure after the welding step.

6. The method according to claim 1 , wherein said method comprises the further step e) performing a cleaning procedure after the welding step.

7. The method according to claim 6 , wherein the performing a cleaning procedure comprises application of a solvent, application of a defoaming agent, wet cleaning, air sucking, air blowing, evaporating and/or burning.

8. The method according to claim 2 , wherein the method comprises the further step:

f) pretreating at least one surface of at least one of the components with a surface tension lowering material.

9. The method according to claim 2 , wherein step d) is performed at a temperature lying in the range of ≥10° C. to ≤80° C.

10. The method according to claim 1 , wherein step d) is performed at a pressure lying in the range of ≥1 mbar to ≤6 bar.

11. The method according to claim 1 , wherein step d) is performed under an atmosphere comprising an inert gas.

12. The method according to claim 1 , wherein the components to be welded are formed from a metal or a polymer.

13. The method of claim 1 , wherein step c) is performed before step b).

14. The method according to claim 1 , wherein step c) is performed after step b).

15. The method according to claim 3 , wherein said method comprises the further step e) performing a cleaning procedure after the welding step.

16. The method according to claim 1 , wherein the method comprises the further step f) pretreating at least one surface of at least one of the components with a surface tension lowering material.

17. The method according to claim 16 , wherein the at least one surface is coated with a polymeric material.

18. The method according to claim 3 , wherein the method comprises the further step f) pretreating at least one surface of at least one of the components with a surface tension lowering material.

19. The method according to claim 1 , wherein step d) is performed at a temperature lying in the range of ≥10° C. to ≤80° C.

20. The method according to claim 3 , wherein step d) is performed at a temperature lying in the range of ≥10° C. to ≤80° C.

Assignments (6)