Smart cards, payment objects and methods
View Patent ↗Smartcards having (i) a metal card body (MCB) with a slit (S) overlapping a module antenna (MA) of a chip module (TCM) or (ii) multiple metal layers (M 1 , M 2 , M 3 ) each having a slit (S 1 , S 2 , S 3 ) offset or oriented differently than each other. A front metal layer may be continuous (no slit), and may be shielded from underlying metal layers by a shielding layer (SL). Metal backing inserts (MBI) reinforcing the slit(s) may also have a slit (S 2 ) overlapping the module antenna. Diamond like coating filling the slit. Key fobs similarly fabricated. Plastic-Metal-Plastic smart cards and methods of manufacture are disclosed. Such cards may be contactless only, contact only, or may be dual-interface (contact and contactless) cards.
1. A solid metal smart card comprising:
a metal card body (MCB) having an opening (MO) for receiving a transponder chip module (TCM);
a slit (S 1 ) extending from an edge of the card body to the opening;
wherein the card body is thinned in an area including the slit so that a back side of the metal card body is recessed; and
a metal backing insert (MBI) disposed in the recess, spanning the slit and reinforcing the card body at the slit area.
2. The smart card of claim 1 , further comprising:
a module cover (MC) inserted into the module opening in the back of the card body.
3. The smart card of claim 1 , wherein:
the thinned area extends to the area of the transponder chip module (TCM), including surrounding the opening;
the metal backing insert (MBI) comprises a module opening and a slit (S 2 ) extending from an edge of the MBI to the module opening; and
the metal backing insert (MBI) is oriented in the card so that the slit (S 2 ) does not extend to an edge of the card body, but rather is located in a central area of the card body.
4. The smart card of claim 1 , wherein:
the thinned area extends to the area of the transponder chip module (TCM), including surrounding the opening; and
the metal backing insert (MBI) does not have a module opening, and has a slit (S 2 ) extending from an edge of the metal backing insert (MBI) to a position at the interior of the metal backing insert (MBI) so that the slit is under a portion of and overlaps a module antenna (MA) of the transponder chip module (TCM).