Cooling device and device
View Patent ↗First and the second heat dissipation sections 120 a and 120 b are thermally coupled with a memory 220 and a CPU 230 mounted on a surface of a substrate 210 , respectively. A frame 130 is arranged above the surface of the substrate. First and second openings 131 a and 131 b are formed at the positions corresponding to the positions at which the first and second heat dissipation sections 120 a are provided in the frame 130 . First and second elastic rubbers 150 a and 150 b (first and second connecting sections) are provided at periphery of the first and second openings. The first and second elastic rubbers connect the first and second heat dissipation sections and the frame, respectively. With this configuration, each of a plurality of heat-generating components is thermally coupled with each of a plurality of heat dissipation sections stably, even when the plurality of heat-generating components have different heights.
1. A cooling device comprising:
first and second heat dissipation sections that are thermally coupled with first and second heat-generating components, respectively, the first and second heat-generating components mounted on a first surface of a substrate;
a frame arranged above the first surface of the substrate;
first and second openings formed in the frame, positions of the first and second openings corresponding to positions at which the first and second heat dissipation sections are provided, respectively;
first and second flexible connecting sections provided at peripheries of the first and second openings, respectively, the first and second connecting sections respectively connecting the first and second heat dissipation sections and the frame; and
first and second flange sections formed at the first and second heat dissipation sections so as to protrude from outer peripheral sections of the first and second heat dissipation sections and to face corresponding outer peripheral rims of the first and second openings, respectively,
wherein the first and second connecting sections are provided between surfaces of the first and second flange sections, which face the first and second openings, and the outer peripheral rims of the first and second openings, respectively, and
when the first and second openings are rectangular, the first flange section are formed so as to trace at least a pair of opposing sides of the first opening, and the second flange sections are formed so as to trace at least a pair of opposing sides of the second opening, and
the first and second flange sections are arranged so as not to face each other between the first and second openings.
2. The cooling device according to claim 1 , wherein
one of or both the first and second connecting sections are each a spring member or a rubber member.
3. The cooling device according to claim 1 , wherein
the first connecting section is a spring member when the first heat-generating component is a central processing unit, and
the second connecting section is a rubber member when the second heat-generating component is a memory.
4. The cooling device according to claim 1 , wherein
the first connecting section, the second connecting section, and the frame are thermally conductive.
5. A device comprising:
first and second heat-generating components mounted on a first surface of a substrate;
first and second heat dissipation sections that are thermally coupled with the first and second heat-generating components, respectively;
a frame arranged above the first surface of the substrate;
first and second openings formed in the frame, positions of the first and second openings corresponding to positions at which the first and second heat dissipation sections are provided, respectively;
first and second flexible connecting sections provided at peripheries of the first and second openings respectively connecting the first and second heat dissipation sections and the frame; and
first and second flange sections formed at the first and second heat dissipation sections so as to protrude from outer peripheral sections of the first and second heat dissipation sections and to face corresponding outer peripheral rims of the first and second openings, respectively,
wherein the first and second connecting sections are provided between surfaces of the first and second flange sections, which face the first and second openings, and the outer peripheral rims of the first and second openings, respectively, and
when the first and second openings are rectangular, the first flange section are formed so as to trace at least a pair of opposing sides of the first opening, and the second flange sections are formed so as to trace at least a pair of opposing sides of the second opening, and
the first and second flange sections are arranged so as not to face each other between the first and second openings.