Optical sensor device and method of manufacturing optical sensor device

1. An optical sensor device comprising:

an element-mounting portion;

an optical sensor element provided on the element-mounting portion;

a lead having a first contact region connected to the optical sensor element and a second contact region for an external connection; and

a resin-encapsulating portion covering at least a light-receiving plane of the optical sensor element, and including a resin and a glass filler, the resin-encapsulating portion having a transmissivity equal to or more than 40% in a wavelength range of 300 nm to 400 nm, the glass filler including borosilicate glass dispersed in the resin, and

a composition of the borosilicate glass satisfying the following conditions (1) to (10) in terms of % by weight in a range where a total weight of the borosilicate glass is 100% by weight:

(1) a weight ratio of SiO 2 is 60% to 70%;

(2) a weight ratio of B 2 O 3 is 5% to 20%;

(3) a weight ratio of Sb 2 O 3 is 1% to 5%;

(4) a total weight ratio of Al 2 O 3 , La 2 O 3 , and Y 2 O 3 , is 3% to 10%;

(5) a total weight ratio of ZnO, MgO, CaO, and SrO is 5% to 15%;

(6) a total weight ratio of Li 2 O, Na 2 O, and K 2 O is 10% to 30%;

(7) a weight ratio of CuO is 1% to 5%;

(8) a weight ratio of TiO 2 is 1% to 5%;

(9) a weight ratio of Co 2 O 3 is 1% to 5%;

(10) a weight ratio of NiO is 1% to 5%.

2. The optical sensor device according to claim 1 , wherein at least a part of the element-mounting portion is exposed from the resin-encapsulating portion.

3. The optical sensor device according to claim 1 , further comprising a mounting substrate portion provided on a side opposite to the light-receiving plane of the optical sensor element.

4. The optical sensor device according to claim 3 ,

wherein the lead and the element-mounting portion are embedded into the mounting substrate portion, and

the first contact region of the lead, the second contact region of the lead and a placement surface of the element-mounting portion are exposed from the mounting substrate portion.

5. The optical sensor device according to claim 4 ,

wherein the first contact region of the lead is exposed from a first surface of the mounting substrate portion on the optical sensor element side, and

the second contact region of the lead is exposed from a second surface of the mounting substrate portion opposite to the first surface.

6. The optical sensor device according to claim 4 , wherein a surface of the element-mounting portion opposite to the placement surface is exposed from the mounting substrate portion.

7. The optical sensor device according to claim 3 , wherein the mounting substrate portion includes a ceramic or a printed circuit board.

8. The optical sensor device according to claim 3 ,

wherein the mounting substrate portion is provided on the same side as the light-receiving plane side of the optical sensor element, and

the mounting substrate portion on the light-receiving plane side has a cavity whose diameter enlarges in a light-receiving direction of the optical sensor element from the element-mounting portion.

9. The optical sensor device according to claim 1 , wherein a particle size of the glass filler is 0.5 μm to 20.0 μm.

10. A method of manufacturing the optical sensor device according to claim 1 , the method comprising:

a step of preparing the glass filler by crushing borosilicate glass which has a transmissivity of equal to or more than 40% in a wavelength range of 300 nm to 400 nm; and

a step of sealing a periphery of the optical sensor element by a transfer molding method using a tablet formed with a mixture of the glass filler and a resin.

11. An optical sensor device comprising:

an element-mounting portion;

an optical sensor element provided on the element-mounting portion;

a lead having a first contact region connected to the optical sensor element and a second contact region for an external connection; and

a resin-encapsulating portion covering at least a light-receiving plane of the optical sensor element, and including a resin and glass filler, the resin-=encapsulating portion having a transmissivity equal to or more than 60% in a wavelength range of 300 nm to 350 nm, the glass filler including borosilicate glass dispersed in the resin, and

a composition of the borosilicate glass satisfying the following conditions (11) to (19) in terms of % by weight in a range where a total weight of the borosilicate glass is 100% by weight:

(11) a weight ratio of SiO 2 is 50% to 70%;

(12) a weight ratio of BaO is 10% to 30%;

(13) a weight ratio of B 2 O 3 is 1% to 5%;

(14) a weight ratio of Sb 2 O 3 is 1% to 5%;

(15) a total weight ratio of Al 2 O 3 , La 2 O 3 , and Y 2 O 3 is 5% to 10%;

(16) a total weight ratio of Li 2 O, Na 2 O, and K 2 O is 10% to 20%;

(17) a weight ratio of CuO is 1% to 5%;

(18) a weight ratio of Co 2 O 3 is 1% to 5; and

(19) a weight ratio of NiO is 1% to 10%.

12. The optical sensor device according to claim 11 , wherein a particle size of the glass filler is 0.5 μm to 20.0 μm.

13. A method of manufacturing the optical sensor device according to claim 11 , the method comprising:

a step of preparing the glass filler by crushing borosilicate glass which has a transmissivity of equal to or more than 60% in a wavelength range of 300 nm to 350 nm; and

a step of sealing a periphery of the optical sensor element by a transfer molding method using a tablet formed with a mixture of the glass filler and a resin.