Method for transfer of semiconductor devices
A method of transferring semiconductor devices to a product substrate includes positioning a surface of the product substrate to face a first surface of a semiconductor wafer having the semiconductor devices thereon, and actuating a transfer mechanism to cause the transfer mechanism to engage a second surface of the semiconductor wafer. The second surface of the semiconductor wafer is opposite the first surface of the semiconductor wafer. Actuating the transfer mechanism includes causing a pin to thrust against a position on the second surface of the semiconductor wafer corresponding to a position of a particular semiconductor device located on the first surface of the semiconductor wafer, and retracting the pin to a rest position. The method further includes detaching the particular semiconductor device from the second surface of the semiconductor wafer, and attaching a particular semiconductor device to the product substrate.
1. A method for transferring semiconductor devices to a product substrate, the method comprising:
providing a transfer mechanism including a pin and an actuator configured to cause the pin to thrust reciprocatively, and a fixing device configured to emit energy to affix the semiconductor devices to the product substrate;
positioning a surface of the product substrate to face a first surface of a semiconductor wafer having the semiconductor devices thereon, and positioning the semiconductor wafer and the product substrate in a transfer position with respect to the transfer mechanism;
actuating the actuator of the transfer mechanism to cause the pin to engage a second surface of the semiconductor wafer, the second surface of the semiconductor wafer being opposite the first surface of the semiconductor wafer, and the actuating the transfer mechanism including causing the pin to thrust against a position on the second surface of the semiconductor wafer corresponding to a position of a particular semiconductor device located on the first surface of the semiconductor wafer, and retracting the pin to a rest position;
detaching the particular semiconductor device from the second surface of the semiconductor wafer; and
attaching the particular semiconductor device to the product substrate by applying energy directly on the product substrate during a transfer operation via the fixing device.
2. The method according to claim 1 , further comprising disposing a circuit trace on the surface of the product substrate,
wherein the attaching the particular semiconductor device to the product substrate includes attaching the particular semiconductor device to the product substrate via the circuit trace.
3. The method according to claim 1 , wherein the particular semiconductor is a first particular semiconductor device, and
wherein the method further comprises repositioning the first surface of the semiconductor wafer with respect to the surface of the product substrate so as to align a second particular semiconductor device to be attached to the surface of the product substrate.
4. The method according to claim 1 , further comprising applying a conductive material to the surface of the product substrate prior to the attaching of the particular semiconductor device,
wherein the attaching the particular semiconductor device to the product substrate includes attaching the particular semiconductor device in contact with the conductive material.
5. The method according to claim 1 , further comprising applying a sealant over the attached particular semiconductor device.
6. The method according to claim 1 , wherein the providing further includes providing a product frame configured to secure the product substrate.
7. The method according to claim 1 , wherein the providing further includes providing a wafer substrate frame configured to secure the semiconductor wafer.