Wound treatment employing antimicrobial composition
A process for reducing bacterial colonization in or around the area of a wound includes applying to the area a gel that includes at least one PEG and an aqueous composition which has a pH of from 2 to 4, a total solute concentration of from 1.8 to 4.0 Osm/L, and from 0.9 to 1.7 g/L of at least one cationic surfactant. The aqueous composition can include a buffer system that includes an organic acid and a salt of an organic acid. The gel is effective even when free of materials having antimicrobial properties other than those provided by the aqueous composition, such as sporicides, antifungals and antibiotics.
1. A process for reducing bacterial colonization in or around the area of a wound, said process comprising applying to said area a gel that comprises at least one PEG and an aqueous composition having a pH of from 2 to 4, a total solute concentration of from 1.8 to 4.0 Osm/L, and from 0.9 to 1.7 g/L of at least one cationic surfactant, said gel being free of sporicides, antifungals and antibiotics.
2. The process of claim 1 wherein said aqueous composition has a total solute concentration of from 1.8 to 2.8 Osm/L.
3. The process of claim 1 wherein said at least one cationic surfactant comprises benzalkonium chloride.
4. The process of claim 1 wherein said at least one cationic surfactant is benzalkonium chloride.
5. A process for reducing bacterial colonization in or around the area of a wound, said process comprising applying to said area a gel that consists essentially of at least one PEG, an aqueous composition having a pH of from 2 to 4, a total solute concentration of from 1.8 to 4.0 Osm/L, and from 0.9 to 1.7 g/L of at least one cationic surfactant, and optionally one or more of an emollient, a lotion, a humectant, a glycosaminoglycan, an analgesic, colloidal silver and a coalescent.
6. The process of claim 5 wherein said aqueous composition has a total solute concentration of from 1.8 to 2.8 Osm/L.
7. The process of claim 5 wherein said at least one cationic surfactant comprises benzalkonium chloride.
8. The process of claim 5 wherein said at least one cationic surfactant is benzalkonium chloride.
9. A process for reducing bacterial colonization in or around the area of a wound, said process comprising applying to said area a gel that comprises
a) at least one PEG and
b) a composition having a pH of from 2 to 4 and a total solute concentration of from 1.8 to 4.0 Osm/L that consists essentially of
(1) water,
(2) a buffer system that comprises of one or more organic acids and at least one salt of one or more organic acids, and
(3) from 0.9 to 1.7 g/L of at least one cationic surfactant,
said gel being free of materials having antimicrobial properties other than those provided by said composition.
10. The process of claim 9 wherein said composition has a total solute concentration of from 1.8 to 2.8 Osm/L.
11. The process of claim 9 wherein said at least one cationic surfactant comprises benzalkonium chloride.
12. The process of claim 9 wherein said at least one cationic surfactant is benzalkonium chloride.
13. The process of claim 9 wherein said one or more organic acids comprise at least one polyacid.
14. The process of claim 13 wherein said at least one polyacid comprises citric acid.
15. The process of claim 14 wherein said at least one salt of one or more organic acids comprises a salt of a polyacid.
16. The process of claim 9 wherein each of said one or more organic acids is a polyacid.
17. The process of claim 9 wherein said one or more organic acids is citric acid.
18. The process of claim 17 wherein said at least one salt comprises a salt of citric acid.
19. The process of claim 9 wherein said at least one salt is a salt of citric acid.
20. The process of claim 9 wherein said one or more organic acids is acetic acid.