Optical recording medium production device and production method
A recording medium production device includes a substrate positioning pin vertically movable that performs positioning to a center-hole of a substrate; a substrate holding portion that performs positioning of substrate using the substrate positioning pin to hold the substrate; a cleaner having a gas ejection portion that ejects gas toward the surface of the substrate held by the substrate holding portion, and a gas suction portion that suctions gas; and a substrate positioning pin fixing portion that can press the substrate positioning pin downward. The fixing portion is configured so as not to contact an inner circumferential side surface of the center-hole of substrate. The substrate positioning pin fixing portion descends inside the center-hole of substrate held by the substrate, and presses and fixes the substrate positioning pin. Then the cleaner performs ejection and suction of gas.
1. An optical recording medium production method comprising the steps of:
holding a substrate positioned by a substrate positioning pin vertically movable to a center hole of the substrate;
pressing the substrate positioning pin downward and fixing the same so as to expose an inner circumferential side surface of the center hole of the substrate; and
removing a foreign material by a cleaner that ejects gas toward a surface of the held substrate and simultaneously suctions the gas.
2. The production method according to claim 1 ,
wherein in the state where the substrate positioning pin is pressed downward and fixed so as to expose the inner circumferential side surface of the center hole of the substrate,
a part of the cleaner can move up to an inner position from the inner circumferential side surface of the held substrate.
3. The production method according to claim 1 , wherein the respective steps are performed immediately before a process of forming a recording film or a reflection film by sputtering a target material to a signal surface of the substrate.
4. The production method according to claim 1 , wherein the respective steps are performed immediately before a process of forming a cover layer to protect a signal surface of the substrate.
5. The production method according to claim 1 , wherein the respective steps are performed immediately before a process of forming a water absorption preventing film by sputtering a back-surface sputtering target material to a surface opposite to a surface where a cover layer to protect a signal surface of the substrate is formed.
6. The production method according to claim 1 , wherein the respective steps are performed immediately before a process of performing printing to a surface where a water absorption preventing film of the substrate is formed.