Granted Patent B2

US 9,755,124 · App. 15/077,255 · Granted Sep 5, 2017

Abstract

Claims (18)

1. A method for manufacturing light-emitting diode (LED) modules in parallel, comprising:

molding a lens array of lenses wherein each lens is adjoined with neighboring lenses;

molding a housing array of housing bodies wherein each housing body is adjoined with neighboring housing bodies;

bonding the lens array's bottom surface to the housing array's top surface to form a combined array;

attaching LEDs to the housings in the combined array; and

singulating the combined array to form individual LED modules.

2. The method of claim 1 , further comprising:

bonding a metal pad array to the housing array or insert molding the metal pad array with the housing array to form metal pads on the back of the housings.

3. The method of claim 2 , further comprising:

forming the metal pad array with tabs for positioning the LEDs in the housing bodies.

4. The method of claim 1 , wherein the LEDs each comprises a submount and one or more LED dies on the submount, and the lenses each has a bottom surface larger than a top surface of each LED.

5. The method of claim 1 , further comprising:

fixing wavelength converting elements to bottom of the lenses in the lens array, wherein:

each housing body comprises a top opening and a bottom opening coupled to the top opening, the top and the bottom openings comprise reflective or scattering sidewalls;

bonding the lens array and the housing array comprises locates the wavelength converting elements in the top opening of the housings; and

attaching the LED to the housings in the combined array comprises locating the LED in the bottom openings of the housing bodies.

6. The method of claim 1 , further comprising:

separating one or more the lens array of lenses and the housing array into smaller arrays for processing.

Assignments (8)