Silicone material, curable silicone composition, and optical device
View Patent ↗This invention relates to a silicone material satisfying any of the following conditions in an elemental composition percentage of the silicone material surface according to X-ray photoelectron spectroscopy (ESCA): (i) the elemental composition percentage of carbon atoms is from 50.0 to 70.0 atom %; (ii) a ratio of the elemental composition percentage of carbon atoms to the elemental composition percentage of silicon atoms (C/Si) is from 2.0 to 5.0; or (iii) both of the above conditions (i) and (ii). The silicone material is stable against light and heat, in which a decrease in transmittance and generation of cracks do not tend to occur.
1. A silicone material satisfying any of the following conditions in an elemental composition percentage of the silicone material surface according to X-ray photoelectron spectroscopy (ESCA):
(i) the elemental composition percentage of carbon atoms is from 50.0 to 70.0 atom %;
(ii) a ratio of the elemental composition percentage of carbon atoms to the elemental composition percentage of silicon atoms (C/Si) is from 2.0 to 5.0; or
(iii) both of the above conditions (i) and (ii).
2. The silicone material according to claim 1 , wherein the silicone material contains an Si—R 1 —Si bond in the structure, where R 1 is an alkylene group or an arylene group.
3. The silicone material according to claim 1 , wherein the silicone material is an optical material.
4. The silicone material according to claim 1 , wherein the silicone material is a sealing material of an optical element.
5. A curable silicone composition which cures to form the silicone material according to claim 1 , the composition comprising: an organopolysiloxane having at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group in a molecule; an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; and a hydrosilylation-reaction catalyst.
6. An optical device formed by sealing an optical element with the silicone material according to claim 1 .
7. The optical device according to claim 6 , wherein the optical element is an LED.
8. The optical device according to claim 7 , wherein the optical device is a chip-on-board LED device.
9. The silicone material according to claim 2 , wherein R 1 is an alkylene group and the alkylene group is a methylmethylene group, an ethylene group, a propylene group, a methylethylene group, a butylene group, or an isobutylene group.
10. The silicone material according to claim 2 , wherein R 1 is an arylene group and the arylene group is a phenylene group, a tolylene group, a xylylene group, or a naphthylene group.
11. The curable silicone composition according to claim 5 , the composition comprising:
(A) an organopolysiloxane represented by the average composition formula:
R 2 a SiO [(4-a)/2]
wherein R 2 are each independently an alkyl group having from 1 to 12 carbons, an alkenyl group having from 2 to 12 carbons, an aryl group having from 6 to 20 carbons, or an aralkyl group having from 7 to 20 carbons, wherein alkenyl groups account for 1 to 20 mol % of all R 2 , aryl groups account for at most 40 mol % of all R 2 , and “a” is a number satisfying the relationship 1≦a <2;
(B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in the molecule, in an amount such that the amount of silicon-bonded hydrogen atoms in this component is from 0.1 to 5 moles per 1 mole of total alkenyl groups in component (A); and
(C) a hydrosilylation reaction catalyst.
12. The curable silicone composition according to claim 11 , wherein component (A) has a dendritic molecular structure.