Semiconductor optoelectronic device with an insulative protection layer and the manufacturing method thereof

1. An optoelectronic device comprising:

a heat dispersion substrate;

an insulative protection layer on the heat dispersion substrate, wherein the insulative protection layer comprises AlInGaN series material; and

an optoelectronic unit comprising an epitaxial structure comprising multiple layers on the insulative protection layer, wherein at least one layer of the epitaxial structure comprises III-V group material devoid of nitride.

2. The optoelectronic device according to claim 1 , further comprising a first connecting layer between the heat dispersion substrate and the insulative protection layer.

3. The optoelectronic device according to claim 2 , further comprising a reflection layer between the first connecting layer and the insulative protection layer.

4. The optoelectronic device according to claim 3 , further comprising an adhesive layer between the reflection layer and the insulative protection layer.

5. The optoelectronic device according to claim 4 , wherein the adhesive layer comprises indium tin oxide or zinc oxide.

6. The optoelectronic device according to claim 2 , further comprising a second connecting layer between the optoelectronic unit and the insulative protection layer.

7. The optoelectronic device according to claim 1 , further comprising a second connecting layer between the optoelectronic unit and the insulative protection layer.

8. The optoelectronic device according to claim 1 , wherein the AlInGaN series material of the insulative protection layer is an undpoed III-V group material.

9. The optoelectronic device according to claim 1 , wherein the III-V group material of the layer of the epitaxial structure comprises AlGaInP series material.

10. The optoelectronic device according to claim 9 , wherein the layer of the epitaxial structure is closest to the insulative protection layer than the other layers of the epitaxial structure.

11. An optoelectronic device comprising:

a heat dispersion substrate;

an insulative protection layer on the heat dispersion substrate, wherein the insulative protection layer comprises AlInGaN series material; and

multiple micro chips on the insulative protection layer, wherein each micro chip has an epitaxial structure comprising multiple layers and a sidewall, and at least one layer of the epitaxial structure comprises III-V group material devoid of nitride.

12. The optoelectronic device according to claim 11 , further comprising an opening between two of the micro chips for separating the two micro chips from each other and exposes the side walls of the two micro chips.

13. The optoelectronic device according to claim 12 , further comprising an insulating layer in the opening and covers the side walls of the two micro chips.

14. The optoelectronic device according to claim 12 , further comprising a conductive structure electrically connected to the two micro chips.

15. The optoelectronic device according to claim 12 , wherein each epitaxial structure comprises a first conductivity type semiconductor layer, a second conductivity type semiconductor layer and an active layer between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, and the two micro chips each comprises two electrodes on the first conductivity type semiconductor layer and on the second conductivity type semiconductor layer respectively.

16. The optoelectronic device according to claim 15 , wherein the conductive structure is in the opening and connects one electrode of one of the two micro chips and one electrode of the other one of the two micro chips.

17. The optoelectronic device according to claim 11 , wherein the III-V group material of the layer of the epitaxial structure comprises AlGaInP series material.

18. The optoelectronic device according to claim 17 , wherein the layer of the epitaxial structure is closest to the insulative protection layer than the other layers of the epitaxial structure.

19. The optoelectronic device according to claim 11 , further comprising a first connecting layer between the heat dispersion substrate and the insulative protection layer.

20. The optoelectronic device according to claim 11 , further comprising a second connecting layer between the micro chips and the insulative protection layer.