Fluid-assisted thermal management of evaporation sources

1. A deposition system comprising:

a deposition chamber having an interior enclosed by one or more chamber walls;

an evaporation source comprising (i) a hollow source body for containing a feedstock material for evaporation thereof, and (ii) an evaporation port for fluidly coupling the source body with the interior of the deposition chamber; and

a thermal management system comprising:

a first reservoir for containing heat-transfer fluid,

a first conduit for thermally coupling the first reservoir with the evaporation source, a portion of the first conduit being disposed within the source body so as to directly contact feedstock material disposed within the source body,

a heater for heating heat-transfer fluid within the first reservoir,

a second reservoir, different from the first reservoir, for containing heat-transfer fluid,

a second conduit for thermally coupling the second reservoir with the evaporation source, a portion of the second conduit being disposed within the source body so as to directly contact feedstock material disposed within the source body,

a cooler for cooling heat-transfer fluid within the second reservoir, and

a controller for controlling flow of heated and cooled heat-transfer fluid through the first and second conduits between the evaporation source and the first and second reservoirs to thereby control a temperature of the evaporation source, whereby heating of the evaporation source at least in part via flow of heated heat-transfer fluid through the first conduit results in vaporization of feedstock material in the source body and flow of vaporized feedstock material into the deposition chamber via the evaporation port.

2. The deposition system of claim 1 , wherein the heater comprises at least one of a heat exchanger or a resistive heater.

3. The deposition system of claim 1 , wherein the cooler comprises a heat exchanger.

4. The deposition system of claim 1 , further comprising a feedstock material disposed within the source body.

5. The deposition system of claim 4 , wherein the feedstock material comprises at least one of phosphorous, sulfur, arsenic, tellurium, or selenium.

6. The deposition system of claim 1 , wherein the thermal management system comprises a second heater for heating the evaporation source in tandem with flow of heated heat-transfer fluid through the first conduit.

7. The deposition system of claim 6 , wherein the second heater comprises at least one of a resistive heater, an electron beam source, a laser source, a thermoelectric heater, or a heat exchanger.

8. The deposition system of claim 1 , wherein the thermal management system comprises a second cooler for cooling the evaporation source in tandem with flow of cooled heat-transfer fluid through the second conduit.

9. The deposition system of claim 8 , wherein the second cooler comprises a source of gas, a heat exchanger, or a thermoelectric cooler.

10. A thermal evaporation source comprising:

a hollow source body for containing a feedstock material for evaporation thereof;

an evaporation port for fluidly coupling the source body with an interior of a deposition chamber;

a first conduit thermally coupled to an interior of the source body, a portion of the first conduit being disposed within the source body so as to directly contact feedstock material disposed within the source body;

fluidly coupled to the first conduit, a first reservoir for containing heat-transfer fluid; and

a first mechanism for heating and/or cooling heat-transfer fluid within the first reservoir, whereby heating of the evaporation source at least in part via flow of heated heat-transfer fluid through the first conduit results in vaporization of feedstock material in the source body and flow of vaporized feedstock material into the deposition chamber via the evaporation port.

11. The thermal evaporation source of claim 10 , wherein the first mechanism for heating and/or cooling heat-transfer fluid comprises at least one of a heater, a resistive heater, or a heat exchanger.

12. The thermal evaporation source of claim 10 , further comprising a feedstock material disposed within the source body.

13. The thermal evaporation source of claim 12 , wherein the feedstock material comprises at least one of phosphorous, sulfur, arsenic, tellurium, or selenium.

14. The thermal evaporation source of claim 10 , further comprising:

a second conduit thermally coupled to an interior of the source body;

fluidly coupled to the second conduit, a second reservoir for containing heat-transfer fluid; and

a second mechanism for heating and/or cooling heat-transfer fluid within the second reservoir.

15. The thermal evaporation source of claim 14 , wherein the second mechanism for heating and/or cooling heat-transfer fluid comprises at least one of a heater, a resistive heater, or a heat exchanger.

16. The thermal evaporation source of claim 10 , further comprising:

fluidly coupled to the first conduit, a second reservoir for containing heat-transfer fluid; and

a second mechanism for heating and/or cooling heat-transfer fluid within the second reservoir.

17. The thermal evaporation source of claim 16 , wherein the second mechanism for heating and/or cooling heat-transfer fluid comprises at least one of a heater, a resistive heater, or a heat exchanger.

18. The thermal evaporation source of claim 10 , further comprising a heater for heating the evaporation source in tandem with flow of heated heat-transfer fluid through the first conduit.

19. The thermal evaporation source of claim 18 , wherein the heater comprises at least one of a resistive heater, an electron beam source, a laser source, a thermoelectric heater, or a heat exchanger.

20. The thermal evaporation source of claim 10 , further comprising a cooler for cooling the evaporation source in tandem with flow of cooled heat-transfer fluid through the first conduit.

21. The thermal evaporation source of claim 20 , wherein the cooler comprises a source of gas, a heat exchanger, or a thermoelectric cooler.