Thin-film deposition methods with fluid-assisted thermal management of evaporation sources

1. A method of thin-film deposition, the method comprising:

providing within a deposition system an evaporation source comprising (i) a source body containing a feedstock material, and (ii) an evaporation port fluidly coupling the source body with an interior of a deposition chamber;

providing a first reservoir of heat-transfer fluid, the first reservoir being thermally coupled to the feedstock material by a first conduit extending from the first reservoir into the source body, a portion of the first conduit being disposed within the source body in direct contact with the feedstock material;

evacuating at least a portion of gas disposed within the deposition chamber, thereby establishing a vacuum ambient therein;

heating a heat-transfer fluid within the first reservoir; and

heating the evaporation source at least in part by flowing heated heat-transfer fluid through the first conduit, whereby at least a portion of the feedstock material vaporizes and exits the source body through the evaporation port.

2. The method of claim 1 , further comprising:

cooling heat-transfer fluid within the first reservoir; and

cooling the evaporation source at least in part by flowing cooled heat-transfer fluid through the first conduit.

3. The method of claim 2 , further comprising cooling the evaporation source in part with a cooling source other than cooled heat-transfer fluid.

4. The method of claim 3 , wherein the cooling source comprises a gas flowed through and/or around at least a portion of the evaporation source.

5. The method of claim 1 , further comprising heating the evaporation source in part with a heat source other than heated heat-transfer fluid.

6. The method of claim 5 , wherein the heat source comprises a resistive heater.

7. The method of claim 1 , further comprising:

providing a second reservoir of heat-transfer fluid, the second reservoir being thermally coupled to at least one of the source body or the feedstock material;

cooling heat-transfer fluid within the second reservoir; and

cooling the evaporation source at least in part by flowing cooled heat-transfer fluid.

8. The method of claim 7 , wherein the second reservoir is thermally coupled to at least one of the source body or the feedstock material via a second conduit extending from the second reservoir.

9. The method of claim 8 , wherein flowing cooled heat-transfer fluid to cool the evaporation source comprises flowing cooled heat-transfer fluid through the second conduit.

10. The method of claim 7 , further comprising cooling the evaporation source in part with a cooling source other than cooled heat-transfer fluid.

11. The method of claim 10 , wherein the cooling source comprises a gas flowed through and/or around at least a portion of the evaporation source.

12. The method of claim 1 , wherein the feedstock material comprises at least one of phosphorus, sulfur, arsenic, tellurium, or selenium.

13. The method of claim 1 , wherein:

the portion of the first conduit disposed within the source body in direct contact with the feedstock material comprises a plurality of discrete, spaced-apart segments of the first conduit, each of the segments being disposed in contact with the feedstock material; and

the segments of the first conduit are fluidly connected by a second portion of the first conduit extending outside of the source body.

14. The method of claim 1 , wherein the heat-transfer fluid comprises a liquid flowable through the first conduit in liquid form up to a temperature of approximately 400° C.

15. The method of claim 1 , wherein the evaporation source is heated at least in part by flowing heated heat-transfer fluid through the first conduit until the feedstock material reaches a first temperature, the method further comprising:

evacuating the heat-transfer fluid from the first conduit; and

thereafter, heating the evaporation source with a heat source other than heated heat-transfer fluid to heat the feedstock material to a second temperature higher than the first temperature.

16. The method of claim 15 , wherein the first temperature approximately corresponds to temperature at which a slope of a temperature-vapor pressure relationship of the heat-transfer fluid increases.

17. A method of thin-film deposition, the method comprising:

providing within a deposition system an evaporation source comprising (i) a source body containing a feedstock material, and (ii) an evaporation port fluidly coupling the source body with an interior of a deposition chamber;

providing a first reservoir of heat-transfer fluid, the first reservoir being thermally coupled to the feedstock material by a first conduit extending from the first reservoir into the source body, a portion of the first conduit being disposed within the source body in direct contact with the feedstock material;

evacuating at least a portion of gas disposed within the deposition chamber, thereby establishing a vacuum ambient therein;

cooling a heat-transfer fluid within the first reservoir;

heating the evaporation source, whereby at least a portion of the feedstock material vaporizes and exits the source body through the evaporation port; and

thereafter, cooling the evaporation source at least in part by flowing cooled heat-transfer fluid through the first conduit.

18. The method of claim 17 , further comprising cooling the evaporation source in part with a cooling source other than cooled heat-transfer fluid.

19. The method of claim 18 , wherein the cooling source comprises a gas flowed through and/or around at least a portion of the evaporation source.

20. The method of claim 17 , wherein the feedstock material comprises at least one of phosphorous, sulfur, arsenic, tellurium, or selenium.

21. The method of claim 17 , wherein the evaporation source is heated, at least in part, with a heat source other than heated heat-transfer fluid.

22. The method of claim 21 , wherein the heat source comprises a resistive heater.

23. The method of claim 17 , wherein:

the portion of the first conduit disposed within the source body in direct contact with the feedstock material comprises a plurality of discrete, spaced-apart segments of the first conduit, each of the segments being disposed in contact with the feedstock material; and

the segments of the first conduit are fluidly connected by a second portion of the first conduit extending outside of the source body.

24. The method of claim 17 , wherein the heat-transfer fluid comprises a liquid flowable through the first conduit in liquid form up to a temperature of approximately 400° C.

25. The method of claim 17 , wherein:

the evaporation source is cooled from a first temperature at least in part by flowing cooled heat-transfer fluid through the first conduit;

the first temperature is above a decomposition point of the heat-transfer fluid; and

a flow rate of the heat-transfer fluid through the first conduit is sufficient to maintain a temperature of the heat-transfer fluid below the first temperature.

26. The method of claim 25 , wherein the first temperature is at least approximately 400° C.