Disk drive head suspension tail with a noble metal layer disposed on a plurality of structural backing islands

1. A method of electrically testing a head gimbal assembly (HGA), the method comprising:

positioning the HGA proximate to an electrical tester, the HGA including a read head and a suspension assembly that comprises a load beam and a laminated flexure, the laminated flexure including a stainless steel layer, a copper trace layer, and a dielectric layer between the stainless steel layer and the copper trace layer, the laminated flexure including a tongue portion that connects to the read head and a flexure tail that extends distally to a flexure tail terminal region, the copper trace layer including a plurality of flexure bond pads in the flexure tail terminal region, the stainless steel layer including a plurality of backing islands, each of the plurality of backing islands aligned with a corresponding one of the plurality of flexure bond pads, each of the plurality of the backing islands including a noble metal testing pad disposed thereon; and

temporarily contacting at least one of the noble metal testing pads with an electrically conductive testing probe of the electrical tester.

2. The method of claim 1 wherein each of the noble metal testing pads comprises gold.

3. The method of claim 1 wherein each of the noble metal testing pads has a noble metal thickness in the range of 0.2 microns to 4 microns.

4. The method of claim 1 wherein each of the plurality of backing islands is electrically connected to the corresponding one of the plurality of flexure bond pads by a conductive via through the dielectric layer.

5. The method of claim 1 wherein the flexure tail terminal region further includes a noble metal grounding pad that is disposed on the stainless steel layer in an adjacent area of the flexure tail terminal region that does not include the plurality of backing islands.

6. The method of claim 5 further comprising temporarily contacting the noble metal grounding pad with an electrically conductive grounding probe of the electrical tester.

7. The method of claim 5 wherein the noble metal grounding pad comprises gold having a gold thickness in the range of 0.2 microns to 4 microns.