BATTERY CIRCUIT CONTACTORS
A method of making a printed wiring board (“PWB”) is disclosed. The PWB may be made by forming openings in a substrate. The substrate may be a dielectric substrate. The dielectric substrate may be at least partially uncured. A conductive sheet may be placed on one or both sides of the substrate to cover the openings. The substrate may be cured. The conductive sheet(s) may then be etched to form conductive tabs within the openings. The conductive tabs are free of dielectric material on both sides of the conductive tab. The conductive tabs may then be coupled to terminals of electrochemical cells to form a circuit as desired.
1 . A method of manufacturing a printed wiring board comprising:
forming at least one opening through a dielectric substrate;
applying a conductor sheet to at least one side of the dielectric substrate to cover the at least one opening with the conductor sheet; and
removing at least a portion of the conductor in areas disposed over the at least one opening to form at least one conductive pad suspended over or within the opening.
2 . The method of claim 1 , further comprising curing the dielectric substrate.
3 . The method of claim 1 , wherein the curing occurs after the forming and applying steps.
4 . The method of claim 1 , further comprising placing the at least one conductive pad over a terminal of an electrochemical cell.
5 . The method of claim 4 , further comprising securing the conductive pad to the terminal of the electrochemical cell.
6 . The method of claim 4 , further comprising welding the conductive pad to the terminal of the electrochemical cell.
7 . The method of claim 1 , wherein the conductor comprises copper.
8 . The method of claim 1 , wherein the dielectric substrate comprises a B-stage epoxy and fiberglass substrate.
9 . The method of claim 1 , wherein a conductor is applied to two opposite sides of the dielectric substrate.
10 . The method of claim 1 , further comprising removing at least a portion of the conductor in areas disposed over the at least one opening to form at least two conductive pads suspended within the opening.
11 . The method of claim 10 , further comprising coupling a first conductive pad to a positive terminal of an electrochemical cell and coupling a second conductive pad to the negative terminal.
12 . A method of manufacturing a printed wiring board comprising:
forming a plurality of openings through a sheet of woven fibers that are pre-impregnated with uncured epoxy;
applying a layer of copper to both sides of the sheet;
curing the sheet with elevated heat and pressure; and
etching at least a portion of the copper in areas disposed over the openings to form at least one copper connector suspended over or within the opening.
13 . The method of claim 12 , further comprising welding the at least one copper connector to a terminal of an electrochemical cell positioned below the sheet.
14 . The method of claim 12 , wherein the sheet of woven fibers that are pre-impregnated with uncured epoxy is B-stage FR4 grade material.
15 . The method of claim 12 , forming a plurality of openings includes punching a plurality of openings through the sheet.
16 . The method of claim 12 , forming a plurality of openings includes laser etching a plurality of openings through the sheet.
17 . A method of electrically connecting a plurality of battery cells comprising:
forming a plurality of openings through an at least partially uncured dielectric substrate;
applying copper to opposites sides of the substrate and covering the plurality of openings;
curing the dielectric substrate;
etching at least a portion of the copper in areas disposed over the openings to form at least one copper connector positioned within each of the plurality of openings;
placing the at least one copper connector on top of a battery cell; and
welding the copper connector to a terminal of the battery.
18 . The method of claim 17 , wherein the welding includes laser welding.
19 . The method of claim 17 , further comprising etching at least a portion of the copper to form a conductive path from the at least one copper connector positioned within each of the plurality of openings to a second position spaced away from the at least one copper connector.