Optical module and manufacturing method thereof
An optical module may include a case, an optical assembly, a circuit board interface positioned on the case, and a circuit board attached to the case through the circuit board interface. The optical assembly may be arranged in the case. The circuit board may include a first area that may electrically connect the circuit board to the optical assembly. The circuit board may also include a second area that may secure the circuit board to the circuit board interface. An optical module manufacturing method is also provided.
1. An optical module, comprising:
a case;
an optical assembly arranged in the case;
a circuit board interface on the case; and
a circuit board attached to the case through the circuit board interface,
wherein the circuit board includes a first area configured to electrically connect the circuit board to the optical assembly, and a second area configured to secure the circuit board to the circuit board interface, and
wherein the circuit board comprises:
a flexible board including a flexible substrate, electrical components, and a metal layer at a portion that corresponds to the circuit board interface on the case, the flexible board extends through the circuit board interface and is welded to the circuit board interface through the metal layer; and
a rigid board connected to the flexible board at a location outside the case, and
wherein the second area includes at least one reinforcing layer, and the circuit board interface is welded to the at least one reinforcing layer.
2. The optical module of claim 1 , wherein the at least one reinforcing layer is arranged on an upper surface of the flexible board, the rigid board is arranged on a lower surface of the flexible board, and the upper surface of the flexible board is a high-speed link layer for high-speed signal transmission.
3. The optical module of claim 2 , wherein the at least one reinforcing layer includes at least one first reinforcing layer, the optical module further including a second reinforcing layer arranged at a location of the lower surface that corresponds to the at least one first reinforcing layer.
4. The optical module of claim 3 , wherein the metal layer is a first metal layer, the optical module further including a second metal layer arranged on the at least one first reinforcing layer and configured to weld onto the case.
5. The optical module of claim 1 , wherein the circuit board includes an adhesive sealant configured to seal the circuit board to the circuit board interface.
6. The optical module of claim 5 , wherein the case comprises an upper part and a lower part, and the upper part of the case and the lower part of the case are sealed together.
7. An optical module manufacturing method, comprising:
attaching a circuit board to a lower part of case, wherein the circuit board includes a first area, a second area, and a third area, and wherein the third area of the circuit board has a greater flexibility compared to the first area of the circuit board and the second area of the circuit board;
attaching an optical assembly to the lower part of the case;
connecting the optical assembly to the first area of the circuit board;
joining a circuit board interface to the second area of the circuit board;
welding an upper part of the case to the circuit board, and
securing the upper part of the case and the lower part of the case together.