Radiation-emitting semiconductor device
View Patent ↗A radiation-emitting semiconductor device includes a housing body having a chip mounting area, a chip connection region, a radiation-emitting semiconductor chip, and a light-absorbing material, wherein the radiation-emitting semiconductor chip is fixed to the chip connection region, the chip connection region is covered with the light-absorbing material at selected locations at which the chip connection region is not covered by the radiation-emitting semiconductor chip, the radiation-emitting semiconductor chip is free of the light-absorbing material in selected locations, the housing body has a cavity in which the at least one radiation-emitting semiconductor chip is arranged, the chip mounting area is a surface of the housing body which abuts the cavity, and the chip mounting area is free of the light-absorbing material in selected locations remote from the chip connection region.
1. A radiation-emitting semiconductor device comprising:
a housing body having a chip mounting area;
a chip connection region;
a radiation-emitting semiconductor chip; and
a light-absorbing material, wherein
the radiation-emitting semiconductor chip is fixed to the chip connection region,
the chip connection region is covered with the light-absorbing material at first selected locations at which said chip connection region is not covered by the radiation-emitting semiconductor chip,
the radiation-emitting semiconductor chip is free of the light-absorbing material in second selected locations,
the housing body has a cavity in which the at least one radiation-emitting semiconductor chip is arranged,
the chip mounting area is a surface of the housing body which abuts the cavity, and
the chip mounting area is free of the light-absorbing material at third selected locations remote from the chip connection region.
2. The device according to claim 1 , wherein a wire connection region is arranged at the chip mounting area.
3. The device according to claim 1 , wherein the chip mounting area is formed with the same color as, or in a similar color to, the light absorbing material.
4. The device according to claim 1 , further comprising a light-transmissive potting material, wherein the potting material is substantially free of the light-absorbing material, and the potting material adjoins the radiation-emitting semiconductor chip and the light-absorbing material in the second selected locations.
5. The device according to claim 4 , wherein the potting material abuts the chip mounting area in the second selected locations.
6. The device according to claim 4 , wherein the potting material is transparent.
7. The device according to claim 4 , wherein the potting material is filled with a phosphor and/or a diffuser.
8. The device according to claim 1 , wherein the housing body and the light-absorbing material are the same color.
9. The device according to claim 2 , wherein the chip connection region and the wire connection region are formed with a metal.
10. The device according to claim 9 , wherein the light-absorbing material inhibits migration and/or oxidation and/or corrosion of the metal.
11. The device according to claim 1 , wherein the light-absorbing material comprises a silicone into which light-absorbing particles are introduced.
12. A display apparatus comprising at least one pixel formed at least partly by the device according to claim 1 .
13. A method of producing the device according to claim 1 comprising applying the light-absorbing material by a jet process.
14. A radiation-emitting semiconductor device comprising:
a housing body having a chip mounting area;
a wire connection region arranged at the chip mounting area;
a wire electrically conductively connecting the wire connection region to the radiation-emitting semiconductor chip;
a chip connection region;
a radiation-emitting semiconductor chip; and
a light-absorbing material, wherein
the radiation-emitting semiconductor chip is fixed to the chip connection region,
the wire connection region is covered with the light-absorbing material at the first selected locations at which it is not covered by the wire,
the chip connection region is covered with the light-absorbing material at first selected locations at which said chip connection region is not covered by the radiation-emitting semiconductor chip,
the radiation-emitting semiconductor chip is free of the light-absorbing material in second selected locations,
the housing body has a cavity in which the at least one radiation-emitting semiconductor chip is arranged,
the chip mounting area is a surface of the housing body which abuts the cavity, and
the chip mounting area is free of the light-absorbing material at third selected locations remote from the chip connection region.
15. The device according to claim 1 , wherein at least 50% of the chip mounting area is free of the light-absorbing material.
16. The device according to claim 1 , wherein the light-absorbing material reflects or reemits at most 25% of light that impinges on an outer area of the light-absorbing material.