Capacitor with volumetrically efficient hermetic packaging
An improved method of forming a capacitor, and capacitor formed thereby, is described. The method comprises forming an anode with an anode lead extending therefrom, forming a dielectric on the anode, forming a solid cathode layer on the dielectric and forming a hermetic encasement on the capacitor wherein the hermetic encasement comprises a conformal non-conductive layer.
1. A capacitor comprising:
an anode with an anode lead extending therefrom;
a dielectric on said anode;
a solid cathode layer on said dielectric;
a hermetic encasement on said capacitor wherein said hermetic encasement comprises a conformal non-conductive layer wherein said conformal non-conductive layer is a ceramic coating.
2. The capacitor of claim 1 wherein said hermetic encasement further comprises a conformal metal coating hermetically sealed to said conformal non-conductive layer.
3. The capacitor of claim 2 wherein said conformal metal coating comprises at least 50% of a surface area of said hermetic encasement.
4. The capacitor of claim 1 wherein said solid cathode layer comprises at least one of a conductive polymer layer, a carbon containing layer and a metal containing layer.
5. The capacitor of claim 1 further comprising an anode termination electrically connected to said anode wire.
6. The capacitor of claim 5 wherein said conforming non-conductive layer is on said anode termination or said anode wire.
7. The capacitor of claim 1 further comprising a cathode termination electrically connected to said solid cathode layer.
8. The capacitor of claim 7 wherein said cathode termination is electrically connected to a conformal metal coating hermetically sealed to said conformal non-conductive layer.
9. The capacitor of claim 1 wherein said conformal non-conductive layer is on said dielectric.
10. The capacitor of claim 1 wherein said conformal non-conductive layer is on said anode wire.
11. The capacitor of claim 1 wherein said hermetic encasement has a leak rate no more than 1×10 −3 atm·cm 3 /second.
12. The capacitor of claim 11 wherein said hermetic encasement has a leak rate no more than 1×10 −8 atm·cm 3 /second of helium.
13. The capacitor of claim 1 further comprising a non-conductive resin encasing a portion of said capacitor.
14. The capacitor of claim 13 wherein said conforming non-conducting layer is on said non-conductive resin.
15. The capacitor of claim 1 wherein said anode wire extends through said ceramic coating.
16. The capacitor of claim 15 wherein said anode wire is hermetically sealed to said ceramic coating.