Optoelectronic semiconductor chip
View Patent ↗An optoelectronic semiconductor chip includes a semiconductor layer sequence having an active layer that generates radiation and at least one n-doped layer adjoining the active layer, the semiconductor layer sequence is based on AlInGaN or on InGaN, one or a plurality of central layers composed of AlGaN each having thicknesses of 25 nm to 200 nm are grown at a side of the n-doped layer facing away from a carrier substrate, a coalescence layer of doped or undoped GaN having a thickness of 300 nm to 1.2 μm is formed at a side of the central layer or one of the central layers facing away from the carrier substrate, a roughening extends from the coalescence layer as far as or into the n-doped layer, a radiation exit area of the semiconductor layer stack is formed partly by the coalescence layer, and the central layer is exposed in places.
1. An optoelectronic semiconductor chip comprising a semiconductor layer sequence having an active layer that generates radiation and having at least one n-doped layer, wherein
the n-doped layer adjoins the active layer,
the semiconductor layer sequence is based on AlInGaN or on InGaN,
one or a plurality of central layers composed of AlGaN each having thicknesses of 25 nm to 200 nm are grown at a side of the n-doped layer facing away from a carrier substrate,
a coalescence layer composed of doped or undoped GaN having a thickness of 300 nm to 1.2 μm is formed at a side of the central layer or of one of the central layers facing away from the carrier substrate,
a roughening extends from the coalescence layer as far as or into the n-doped layer,
a radiation exit area of the semiconductor layer stack is formed partly by the coalescence layer, and
the central layer is exposed in places.
2. The optoelectronic semiconductor chip according to claim 1 , further comprising a carrier substrate at a p-side of the semiconductor layer sequence.
3. The optoelectronic semiconductor chip according to claim 2 , further comprising a first contact layer fitted to the p-side of the semiconductor layer sequence, wherein the semiconductor layer sequence connects to the carrier substrate via the first contact layer.
4. The optoelectronic semiconductor chip according to claim 3 , wherein a further contact layer is fitted to the side of the semiconductor layer sequence facing away from the carrier substrate.