Aliphatic materials and uses thereof in heating and cooling applications
View Patent ↗Aliphatic materials and their use in passive heating and cooling applications are generally disclosed. In some embodiments, dibasic acids and esters (diesters) thereof and their use in passive heating and cooling applications are disclosed. In some embodiments, C 18 dibasic acids and esters thereof are disclosed, including their use in passive heating and cooling applications. In some embodiments, various olefins, including alkenes and olefinic acids and esters, are disclosed, including their use in passive heating and cooling applications.
1. A method of storing or releasing thermal energy, the method comprising:
using a compound of formula (I):
wherein:
X 1 is —(CH 2 ) 16 —, —(CH 2 ) 18 —, —(CH 2 ) 20 —, or —(CH 2 ) 22 —;
R 1 is C 1-12 oxyalkyl, which is optionally substituted one or more times by substituents selected independently from the group consisting of —OH and C 1-6 oxyalkyl;
R 2 is a C 1-12 alkyl, C 2-12 alkenyl, C 1-12 oxyalkyl, C 3-12 cycloalkyl, or C 2-12 heterocyclyl, each of which is optionally substituted one or more times by substituents selected independently from R x , or R 2 is a hydrogen atom;
R x is a halogen atom, —OH, —NH 2 , C 1-6 alkyl, C 1-6 heteroalkyl, or C 2-6 alkenyl.
2. The method of claim 1 , wherein X 1 is —(CH 2 ) 16 —.
3. The method of claim 1 , wherein R 2 is a hydrogen atom.
4. The method of claim 1 , wherein R 2 is C 1-12 alkyl, which is optionally substituted one or more times by substituents selected independently from R x .
5. The method of claim 1 , wherein R 2 is C 1-12 oxyalkyl, which is optionally substituted one or more times by substituents selected independently from the group consisting of —OH and C 1-6 oxyalkyl.
6. The method of claim 1 , wherein R 2 is C 3-12 cycloalkyl, which is optionally substituted one or more times by substituents selected independently from R x .
7. The method of claim 1 , wherein the method comprises a method for storing thermal energy.
8. The method of claim 7 , wherein the method is a method for storing thermal energy, and wherein the using comprises:
providing a composition comprising the compound of formula (I), wherein at least a portion of the compound in the composition is in a solid state; and
exposing the composition to a thermal environment having a temperature above the melting point of the compound.
9. The method of claim 8 , wherein the composition consists of or consists essentially of the compound of formula (I).
10. The method of claim 1 , wherein the method comprises a method for releasing thermal energy.
11. The method of claim 10 , wherein the method is a method of releasing thermal energy and the using comprises:
providing a composition comprising the compound of formula (I), wherein at least a portion of the compound in the composition is in a liquid state; and
exposing the composition to a thermal environment having a temperature below the melting point of the compound.
12. The method of claim 11 , wherein the composition consists of or consists essentially of the compound of formula (I).