IP Library Granted Patent US 9,883,597
Granted Patent B2
US 9,883,597 · App. 15/100,499 · Granted Jan 30, 2018

Solder supply device including a nozzle with a piston and a demarcating member that demarcates an air chamber in which air is supplied to move the piston relative to a solder container

Inventors: Akihiro Senga (Okazaki, JP); Shoji Fukakusa (Yokkaichi, JP); Ritsuo Hirukawa (Nishio, JP); Yoji Fujita (Okazaki, JP); Yoshimune Yokoi (Kiyosu, JP)
Assignee: FUJI MACHINE MFG. CO., LTD.
H05K3/3468B05C11/1002B05C17/00533B23K3/06B23K3/0638B41F15/40B41F15/405B41F15/42B41F15/423H05K3/1233B23K2201/42
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Quick Facts
Patent No.
US 9,883,597
App. No.
15/100,499
Granted
Jan 30, 2018
Kind
B2
Abstract

A solder supply device provided with a solder cup housing liquid solder that is tubular and open at one end; a nozzle section, for ejecting solder from the solder container, that is inserted into the solder container; a flange section that is provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup; and an outer tube that demarcates an air chamber with the bottom surface of the solder cup. Solder is supplied from the tip of the nozzle section by the solder cup and the flange section being relatively moved by supplying air to the air chamber. Solder is supplied from the solder container without using an air cylinder, electromagnetic motor, or the like.

Claims (28)

1. A solder supply device comprising:

a solder container housing liquid solder that is tubular, is open at an opening provided at a first end of the solder container, and includes a bottom at a second end of the solder container;

an outer tube inside which the solder container is stored;

a nozzle, for ejecting solder from the solder container, that is inserted into the solder container;

a piston that is provided on an outer circumferential section of the nozzle and that is engaged inside of the solder container from the opening of the solder container; and

a demarcating member that demarcates an air chamber with at least one of the following: a surface of the second end of the solder container, an adapter attached to the surface of the second end of the solder container, or a surface of the piston facing the opening of the solder container,

wherein the solder supply device supplies solder from a tip of the nozzle by relatively moving the solder container and the piston by supplying air to the air chamber such that the piston advances inside the solder container between a first position and a second position, the piston being closer to the opening of the solder container in the first position than in the second position, and

wherein, in the second position of the piston, the solder container and the piston are removable from the outer tube as a single assembly from the outer tube.

2. The solder supply device according to claim 1 , wherein

the piston is provided on the outer circumferential section of the nozzle relatively movable to the nozzle,

the solder supply device is further provided with a lid that seals the opening of the solder container in a state with the tip of the nozzle inserted into the solder container, and

the lid functions as the demarcating member.

3. The solder supply device according to claim 1 , wherein

the piston is fixedly provided on the outer circumferential surface of the nozzle,

the outer tube is tubular with an opening at a first end of the outer tube and that stores the solder container in a state with the second end of the solder container engaged from the opening, and

the tube functions as the demarcating member.

4. The solder supply device according to claim 3 , wherein

the solder supply device is further provided with an inner tube that is tubular with an opening at first and second ends of the inner tube, holds the piston or the nozzle at the first end of the inner tube, extends from the opening of the solder container at the second end of the inner tube, and is fixed to the outer tube.

5. The solder supply device according to claim 4 , wherein

the inner tube is separable from the piston or the nozzle.

6. The solder supply device according to claim 4 , wherein

a surface of a second end of the outer tube is openable/closable.

7. The solder supply device according to claim 6 , wherein

the outer tube is swingably attached to a solder printer that prints solder on a target object.

8. The solder supply device according to claim 6 , wherein

a friction arising between the piston provided at the outer circumferential section of the nozzle and the inner circumferential surface of the solder container is greater than a holding force of the piston or the nozzle by the inner tube.

9. The solder supply device according to claim 2 , wherein

the solder supply device is detachably mounted on a solder printer that prints solder on a target object by a lock mechanism.

Assignments (2)
CHANGE OF NAME Recorded Jul 19, 2018
From: FUJI MACHINE MFG. CO., LTD.
To: FUJI CORPORATION
Reel/Frame 046591/0109 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 31, 2016
From: SENGA, AKIHIRO; FUKAKUSA, SHOJI; HIRUKAWA, RITSUO; FUJITA, YOJI; YOKOI, YOSHIMUNE
To: FUJI MACHINE MFG. CO., LTD.
Reel/Frame 038752/0014 →
Continuity (1)
Related Publication 20160338209A1 · Nov 17, 2016