Mounting assembly and lighting device
A mounting assembly ( 10 ) is disclosed for mounting and connecting an electrical device, in particular a light emitting diode. The mounting assembly ( 10 ) comprises a mounting element ( 12 ) including at least two metal layers ( 14, 16 ) each having a top surface ( 24 ) and a bottom surface ( 28 ). Top contact pads are formed at the top surface of each of the metal layers for providing a planar electrical and thermal contact to the electrical device. Bottom contact pads are formed at the bottom surface of each of the metal layers for providing a planar electrical and thermal contact to a mounting board ( 34 ).
1. A lighting device, comprising:
a light emitting diode comprising contact pads at a surface opposite to a light emitting surface;
a mounting assembly, comprising:
a lead frame comprising:
at least two metal plates each having a top surface and a bottom surface, the metal plates being disposed in one plane and comprising opposing shoulders so top surfaces of the metal plates are disposed in a first distance (d 1 ) apart and bottom surfaces of the metal plates are disposed in a second distance (d 2 ) apart that is larger than the first distance (d 1 );
a top contact area or a top contact pad formed at the top surface of each of the metal plates, the top contact areas or the top contact pads being laminarly connected to the corresponding contact pads of the light emitting diode; and
a bottom contact area or a bottom contact pad formed at the bottom surface of each of the metal plates;
a dielectric layer disposed on the top surfaces of the metal plates and surrounding the electrical device, the dielectric layer forming a carrier for the metal plates to provide a rigid housing; and
a mounting board comprising a printed circuit board or a ceramic board, the mounting board having top contact pads laminarly connected to the corresponding bottom contact areas or the corresponding bottom contact pads of the lead frame.
2. The device as claimed in claim 1 , wherein the bottom surface is formed at a surface of the metal plates opposite to the top surface.
3. The device as claimed in claim 1 , wherein the bottom surface is formed parallel to the top surface.
4. The device as claimed in claim 1 , wherein an isolation element is disposed in the gap between the metals plates.
5. The device as claimed in claim 1 , wherein the top contact area or top contact pad and the bottom contact area or the bottom contact pad are respectively overlapping in a vertical viewing direction on the top surface.
6. The device as claimed in claim 1 , further comprising a second lead frame disposed on a top surface of the dielectric layer surrounding the electrical device.
7. The device as claimed in claim 1 , wherein the metal plates have a thickness of 210 to 300 micrometers.
8. The device as claimed in claim 1 , wherein the dielectric layer is formed by a glass reinforced epoxy layer.
9. The device as claimed in claim 1 , wherein the metal plates each comprises larger dimensions than the electrical device.