Metal encapsulant having good heat dissipation properties, method of manufacturing same, and flexible electronic device encapsulated in said metal encapsulant
The present invention relates to a metal encapsulant having good heat dissipation properties, a method of manufacturing same, and a flexible electronic device encapsulated in said metal encapsulant, and particularly, to a metal encapsulant having excellent flexibility, moisture resistance, workability, and heat dissipation properties by forming a coating layer including a metal graphite composite on one surface thereof, to a method of manufacturing same, and a flexible electronic device encapsulated in said metal encapsulant.
1. A metal encapsulant having heat dissipation properties comprising:
metal foil; and
a coating layer formed on one surface of the metal foil and including a main resin and a metal-graphite composite,
wherein the metal foil has a thickness of 8 μm to 100 μm.
2. The metal encapsulant having heat dissipation properties of claim 1 , wherein the coating layer has a thickness of 1 μm to 10 μm.
3. The metal encapsulant having heat dissipation properties of claim 1 , wherein the metal-graphite composite in the coating layer is included in an amount of 5% by weight to 20% by weight with respect to a total weight of the coating layer.
4. The metal encapsulant having heat dissipation properties of claim 1 , wherein, in the metal-graphite composite, a metal binds to graphite in an amount of 20 parts by weight to 70 parts by weight with respect to 100 parts by weight of the graphite.
5. The metal encapsulant having heat dissipation properties of claim 4 , wherein the metal has an average particle size of 10 nm to 100 nm.
6. The metal encapsulant having heat dissipation properties of claim 1 , wherein the main resin in the coating layer is one or more selected from the group consisting of a polyurethane resin, a polyethylene resin, a polystyrene resin, a polypropylene resin, an ethylene vinyl acetate resin, an acrylic resin, a silicone resin and a fluorine resin.
7. The metal encapsulant having heat dissipation properties of claim 1 , further comprising a heat conductive layer formed on the other surface of the metal foil and including a main resin and a metal-graphene composite.
8. The metal encapsulant having heat dissipation properties of claim 7 , wherein the heat conductive layer has a thickness of 0.1 μm to 5 μm.
9. The metal encapsulant having heat dissipation properties of claim 7 , wherein the metal-graphene composite in the heat conductive layer is included in an amount of 5% by weight to 20% by weight based on a total weight of the heat conductive layer.
10. The metal encapsulant having heat dissipation properties of claim 7 , wherein, in the metal-graphene composite, a metal binds to graphene in an amount of 20 parts by weight to 70 parts by weight with respect to 100 parts by weight of the graphene.
11. The metal encapsulant having heat dissipation properties of claim 10 , wherein the metal has an average particle size of 10 nm to 100 nm.
12. The metal encapsulant having heat dissipation properties of claim 7 , wherein the main resin in the heat conductive layer is one or more selected from the group consisting of a polyurethane resin, a polyethylene resin, a polystyrene resin, a polypropylene resin, an ethylene vinyl acetate resin, an acrylic resin, a silicone resin and a fluorine resin.
13. A flexible electronic device encapsulated by the metal encapsulant of claim 1 , the flexible electronic device comprising:
an adhesive film layer laminated on top of the flexible electronic device; and
the metal encapsulant encapsulating the flexible electronic device by being laminated on top of the adhesive film layer,
wherein the metal encapsulant is laminated on the top of the adhesive film layer so that the coating layer is disposed to face ambient atmosphere.