IP Library Granted Patent US 10,134,988
Granted Patent B2
US 10,134,988 · App. 15/103,969 · Granted Nov 20, 2018

System for forming an electroactive layer

Inventors: Adam Fennimore (Wilmington, DE); Denis Yurievich Kondakov (Wilmington, DE); Nora Sabina Radu (Landenberg, PA)
Assignee: E I DU PONT DE NEMOURS AND COMPANY
H01L51/0003C07C15/24C07F7/0809C08G73/0266H01L51/0007H01L51/0035H01L51/0043H01L51/0058H01L51/0094H01L51/5024H01L51/5056H01L51/56
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Quick Facts
Patent No.
US 10,134,988
App. No.
15/103,969
Granted
Nov 20, 2018
Kind
B2
Abstract

There is provided an electroactive system for forming an electroactive layer. The system includes: (a) a first electroactive material; (b) a facilitation additive; and (c) a first liquid medium. The facilitation additive is present during baking in an amount sufficient to enable the electroactive layer made therefrom to effectively resist mixing with a second liquid medium applied thereover after the electroactive system is deposited and baked at a temperature less than 350° C. for a predetermined time.

Claims (10)

1. A composition comprising a mixture of:

(a) a first electroactive material;

(b) a facilitation additive having no crosslinkable groups; and

(c) a first liquid medium;

wherein the facilitation additive is present during baking in an amount sufficient to enable an electroactive layer made from the composition to effectively resist mixing with a second liquid medium applied over the electroactive layer after the composition is deposited onto a workpiece and baked at a temperature less than 350° C. for a predetermined time;

wherein the facilitation additive has a vapor pressure at 225° C. that is in a range of 10 −3 Pa to 40 Pa.

2. The composition of claim 1 , wherein the electroactive material comprises at least one photoactive material and at least one host material.

3. The composition of claim 1 , wherein the electroactive material comprises hole transport material.

4. The composition of claim 1 , wherein the facilitation additive is a small molecule having a molecular weight less than 2000.

5. The composition of claim 1 , wherein the facilitation additive has a boiling point of 150° C. or greater.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: LG CHEM, LTD.
Reel/Frame 050150/0482 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2016
From: FENNIMORE, ADAM; KONDAKOV, DENIS YURIEVICH; RADU, NORA SABINA
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 039778/0592 →
Continuity (2)
Provisional Application 61915587 · Dec 13, 2013
Related Publication 20160315259A1 · Oct 27, 2016