Semiconductor device
View Patent ↗A semiconductor device includes a main IGBT region in which an IGBT is provided, a main diode region in which a diode is provided, a sense IGBT region in which an IGBT is provided, and a sense diode region in which a diode is provided. A clearance between the body region and the anode region is longer than a product of electron mobility and electron lifetime in the n-type region between the body region and the anode region. A clearance between an end of the collector region on a sense diode region side and the body region is longer than a product of electron mobility and electron lifetime in the n-type region between the end and the body region.
1. A semiconductor device, comprising a semiconductor substrate including a main IGBT region in which an IGBT is provided, a main diode region in which a diode is provided, a sense IGBT region in which an IGBT is provided, and a sense diode region in which a diode is provided,
a front surface electrode provided on a front surface of the semiconductor substrate, and
a rear surface electrode provided on a rear surface of the semiconductor substrate,
wherein
an area of the sense IGBT region is smaller than an area of the main IGBT region,
an area of the sense diode region is smaller than an area of the main diode region,
an emitter region, a body region, an IGBT drift region, a collector region, a gate insulating film, and a gate electrode are provided in the sense IGBT region,
the emitter region is of n-type and in direct contact with the front surface electrode,
the body region is of p-type and in direct contact with the emitter region,
the IGBT drift region is of n-type, in direct contact with the body region, and separated from the emitter region by the body region,
the collector region is of p-type, in direct contact with the IGBT drift region, in direct contact with the rear surface electrode, and separated from the body region by the IGBT drift region,
the gate insulating film is in direct contact with the body region, and
the gate electrode faces the body region via the gate insulating film,
an anode region, a diode drift region and a cathode region are provided in the sense diode region,
the anode region is of p-type and in direct contact with the front surface electrode,
the diode drift region is in direct contact with the anode region,
the cathode region is of n-type, is separated from the anode region by the diode drift region, is in direct contact with the rear surface electrode, and has a higher n-type impurity density than the diode drift region,
wherein
the body region is separated from the anode region by the IGBT drift region and the diode drift region,
a high density n-type region having a higher n-type impurity density than the IGBT drift region and the diode drift region is provided between the IGBT drift region and the diode drift region, and
the high density n-type region extends from the front surface to a position deeper than center portions of the IGBT drift region and the diode drift region in a thickness direction of the IGBT drift region and the diode drift region.
2. The semiconductor device of claim 1 , wherein the cathode region is located right below the anode region.
3. The semiconductor device of claim 1 , wherein
the high density n-type region is in direct contact with the IGBT drift region and the diode drift region.
4. The semiconductor device of claim 1 , wherein the high density n-type region extends from the front surface to a position being in direct contact with the collector region and the cathode region.