IP Library Granted Patent US 9,691,959
Granted Patent B2
US 9,691,959 · App. 15/104,387 · Granted Jun 27, 2017

Light emitting device package

Inventors: Paul Dijkstra (Eindhoven, NL); Aernout Reints Bok (Eindhoven, NL); Pascal Johannes Theodorus Lambertus Oberndorff (Eindhoven, NL); Lu Fei Zhang (Eindhoven, NL); Boudewijn Ruben De Jong (Eindhoven, NL); Marcus Franciscus Donker (Wijchen, NL)
Assignee: Koninklijke Philips N.V.
H01L33/62H01L33/486H01L33/60H01L2224/16245H01L2224/32245H01L2224/48091H01L2224/48247H01L2224/73265H01L2933/0033H01L2933/0058H01L2933/0066
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Quick Facts
Patent No.
US 9,691,959
App. No.
15/104,387
Granted
Jun 27, 2017
Kind
B2
Abstract

A packaged light emitting device die includes a package body having a profiled leadframe embedded in a body of reflecting material. The leadframe is exposed on mounting surface only on at least one solder bonding area. Solder is present only on the at least one solder bonding area and not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe. Moreover, the reflecting material can function as a solder resist to self-align the solder to the at least one solder bonding area.

Claims (14)

1. A packaged light emitting device comprising:

a package comprising a body having a reflective surface, the package further comprising a leadframe;

the leadframe having a raised portion and a lower portion, the raised portion being exposed through the reflective surface of the body to define at least one solder bonding area surrounded by the reflective surface;

a mounting surface for a light emitting device die comprising a continuous planar surface formed of the at least one solder bonding area and the reflective surface,

wherein the planar reflective surface resists solder so that the solder does not adhere to the planar reflective surface;

the lower portion of the leadframe being encased in the body;

solder covering the at least one solder bonding area but not the surrounding reflective surface; and

the light emitting device die mounted to the at least one solder bonding area by the solder, such that the reflective surface planar with the at least one solder area surrounds the light emitting device die.

2. A packaged light emitting device according to claim 1 wherein:

the leadframe is additionally exposed at the mounting surface to define at least one wire bonding area; and

the mounting surface is of the reflective surface apart from the at least one solder bonding area and the at least one wire bonding area;

the device further comprising at least one bonding wire connecting the die to the at least one wire bonding area.

3. A packaged light emitting device according to claim 1 wherein the body is in the form of a reflective cup.

4. A packaged light emitting device according to claim 1 wherein the body is flat.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →
RELEASE OF SECURITY INTEREST Recorded Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
SECURITY INTEREST Recorded Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
PATENT SECURITY AGREEMENT Recorded Dec 9, 2022
From: LUMILEDS, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 062114/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 9, 2018
From: KONINKLIJKE PHILIPS N.V.
To: LUMILEDS LLC
Reel/Frame 045859/0005 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 12, 2016
From: DIJKSTRA, PAUL; BOK, AERNOUT REINTS; OBERNDORFF, PASCAL JOHANNES THEODORUS LAMBERTUS; ZHANG, LUFEI; DE JONG, BOUDEWIJN RUBEN; DONKER, MARCUS FRANCISCUS
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 040001/0467 →
Priority Claims (2)
WO PCT/CN2013/001603 · Dec 19, 2013 · international
EP 14150307 · Jan 7, 2014 · regional
Continuity (1)
Related Publication 20160315237A1 · Oct 27, 2016