Method for connecting a first component to a second component
A method is provided for connecting a first component to a second component, wherein the first component has a deformation region. The deformation region is at least partially heated in a first step. In a second step an inner die, having an optical component for plastic deformation, is provided. In a third step the first component is plastically deformed in the deformation region in order to connect the first component to the second component. Light for heating the first component is directed at the deformation region by means of the optical component of the inner die in the first and/or third step.
1. A method for connecting a first component to a second component, the method comprising the steps of:
providing the first component with a deformation region;
at least partially heating the deformation region;
providing an inner die with an optical component for plastic deformation;
plastically deforming the first component in the deformation region to connect the first component to the second component; and
directing light for heating the first component onto the deformation region by way of the optical component of the inner die for the step of at least partially heating the deformation region or for the step of plastically deforming the first component or for both the steps of heating the deformation region and plastically deforming the first component.
2. The method as claimed in claim 1 , wherein the first component is formed by a hollow body with an axis of symmetry.
3. The method as claimed in claim 2 , wherein:
the step of providing the inner die with the optical component includes arranging the inner die in the hollow body of the first component; and
the step of directing light for heating comprises directing light onto an inner side of the hollow body of the first component.
4. The method as claimed in claim 1 , further comprising the step of removing the inner die from the first component.
5. The method as claimed in claim 1 , wherein the deformation region is irradiated in a first subregion, the light for heating the first subregion being passed through a first clearance in a wall of the inner die.
6. The method as claimed in claim 1 , wherein the light for heating the first component is conducted by way of further optical components comprising filters, lenses, beam-spreading systems.
7. The method as claimed in claim 1 , further comprising monitoring a thermal state of the first component by a detector unit.
8. The method as claimed in claim 7 , wherein, for monitoring an inner side of the first component, information concerning the thermal state is passed by way of the optical component to the detector unit.
9. The method as claimed in claim 7 , wherein, for monitoring an inner side of the first component, information concerning the thermal state is passed by way of further optical components to the detector unit.