IP Library Granted Patent US 10,434,562
Granted Patent B2
US 10,434,562 · App. 15/105,244 · Granted Oct 8, 2019

Method for connecting a first component to a second component by plastic deformation

Inventors: Andreas Dannheisig (Sassenberg, DE); Maximilian Platvoet (Remscheid, DE); Ludger Mühlenbrock (Recklinghausen, DE)
Assignee: JOHNSON CONTROLS GMBH
B21D39/06B21D37/16B21D39/20B21D39/203B23P11/025Y10T29/4992Y10T29/49865Y10T29/49911Y10T29/49915
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Quick Facts
Patent No.
US 10,434,562
App. No.
15/105,244
Granted
Oct 8, 2019
Kind
B2
Abstract

A method is provided for connecting a first component to a second component. The first component has a deformation region, wherein the deformation region is at least partially heated in a first step. An inner die for the plastic deformation is provided in a second method step. The first component is plastically deformed in the deformation region in order to connect the first component to the second component in a third step, and wherein the deformation region is at least partially contacted by the inner die in the second step.

Claims (27)

1. A method for connecting a first component to a second component, the method comprising the steps of:

providing the first component with a deformation region;

at least partially heating the deformation region;

providing an inner die for the plastic deformation; and

plastically deforming the first component in the deformation region to connect the first component to the second component and wherein the deformation region is at least partially contacted by the inner die, wherein plastically deforming the first component comprises an upset bulging, wherein the inner die has a movable portion, the movable portion being contacted at least partially with the deformation region, wherein in the step of plastically deforming the first component, the movable portion is moved out or spread, the inner die being arranged in a hollow body of the first component, the inner die being rotated during said step of plastically deforming the first component.

2. The method as claimed in claim 1 , wherein the inner die has a movable portion, the movable portion being contacted at least partially with the deformation region.

3. The method as claimed in claim 1 , wherein:

the movable portion of the inner die is pressed against the inner side of the hollow body during said step of plastically deforming the first component.

4. The method as claimed in claim 1 , wherein the inner die is removed from the first component subsequent to said step of plastically deforming the first component.

5. The method as claimed in claim 1 , wherein the deformation region is heated at least partially by radiation or induction or by both radiation and induction.

6. The method as claimed in claim 1 , wherein the inner die is moved at least partially along the deformation region.

7. An inner die with movable portions for connecting a first component to a second component by plastically deforming the first component in a heated deformation region of the first component to connect the first component to the second component and wherein the inner die includes at least one movable portion to at least partially contact the deformation region, wherein plastically deforming the first component comprises an upset bulging, the movable portion being moved out or spread during plastically deforming the first component and the inner die being rotated during plastically deforming the first component.

8. The inner die as claimed in claim 7 , wherein the inner die has an axis of symmetry, the inner die having a first cross section in a plane running perpendicularly in relation to the axis of symmetry when the movable portion is in a retracted position and the inner die having a second cross section in a plane running perpendicularly in relation to the axis of symmetry when the movable portion is in an extended position, the second cross section being greater than the first cross section.

9. The inner die as claimed in claim 8 , wherein the inner die with the retracted portion can be guided contactlessly into a cavity region of the first component or out of the cavity region of the first component.

10. The inner die as claimed in claim 8 , wherein the inner die is moved at least partially along the deformation region.

11. The inner die as claimed in claim 8 , wherein the movable portion at least partially contacts the deformation region.

12. The inner die as claimed in claim 8 , wherein the first component is formed by a hollow body.

13. The inner die as claimed in claim 12 , wherein the inner die is arranged in the hollow body of the first component and the movable portion of the inner die is pressed against the inner side of the hollow body during plastically deforming the first component.

14. The inner die as claimed in claim 13 , wherein the inner die is removeable from the first component subsequent to plastically deforming the first component.

15. The inner die as claimed in claim 8 , wherein the heated deformation region is heated at least partially by radiation or induction or by both radiation and induction.

16. The inner die as claimed in claim 7 , wherein the upset bulging comprises a first bulge and a second bulge defined by the first component, the second component being located between the first bulge and the second bulge.

17. A method for connecting a first component to a second component, the method comprising the steps of:

providing the first component with a deformation region;

at least partially heating the deformation region;

providing an inner die for the plastic deformation; and

plastically deforming the first component in the deformation region to connect the first component to the second component, wherein the deformation region is at least partially contacted by the inner die, the inner die having a movable portion, the inner die being arranged in an interior space of the first component during the step of plastically deforming the first component, the movable portion contacting at least a portion of the deformation region during the step of plastically deforming the first component, wherein the inner die is rotated during the step of plastically deforming the first component.

18. The method as claimed in claim 17 , wherein plastically deforming the first component forms a first projection and a second projection extending from the first component, the second component being in contact with the first projection and the second projection.

Assignments (5)
NOTICE OF GRANT OF SECURITY INTEREST IN IP Recorded Nov 17, 2022
From: ADIENT US LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 061956/0301 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 14, 2022
From: ADIENT GLOBAL HOLDINGS LTD.
To: ADIENT US LLC
Reel/Frame 059086/0636 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 17, 2022
From: ADIENT LUXEMBOURG HOLDING S.A.R.L.
To: ADIENT GLOBAL HOLDINGS LTD.
Reel/Frame 058751/0678 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 24, 2020
From: JOHNSON CONTROLS GMBH
To: ADIENT LUXEMBOURG HOLDING S.A R.L.
Reel/Frame 055026/0876 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 27, 2016
From: DANNHEISIG, ANDREAS; PLATVOET, MAXIMILIAN; MÜHLENBROCK, LUDGER
To: JOHNSON CONTROLS GMBH
Reel/Frame 039861/0790 →
Priority Claims (2)
DE 10 2013 020 831 · Dec 17, 2013 · national
DE 10 2014 206 028 · Mar 31, 2014 · national
Continuity (1)
Related Publication 20160311008A1 · Oct 27, 2016