IP Library Granted Patent US 10,072,151
Granted Patent B2
US 10,072,151 · App. 15/106,556 · Granted Sep 11, 2018

Room-temperature-curable silicone rubber composition, and the use thereof

Inventors: Harumi Kodama (Chiba, JP); Masayuki Onishi (Chiba, JP)
Assignee: DOW CORNING TORAY CO., LTD.
C08L83/04C09J183/04C09K3/1018C08G77/18C08L2203/20C08L2205/025C08L2205/05
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Quick Facts
Patent No.
US 10,072,151
App. No.
15/106,556
Granted
Sep 11, 2018
Kind
B2
Abstract

A room-temperature-curable silicone rubber composition exhibiting good adhesion to a substrate contacted during curing and capable of suppressing the occurrence of oil bleeding is disclosed. The room-temperature-curable silicone rubber composition comprises: (A) a mixture of (A1) an organopolysiloxane having at least two specified alkoxysilyl-containing groups in the molecular and (A2) an organopolysiloxane having one specified alkoxysilyl-containing group in the molecular; (B) an organopolysiloxane lacking a hydroxyl group and an alkoxy group; (C) an alkoxysilane; and (D) a condensation-reaction catalyst.

Claims (28)

1. A room-temperature-curable silicone rubber composition comprising: (A) 100 parts by mass of a mixture containing components (A1) and (A2) in a mass ratio of from 1:10 to 10:1 below:

(A1) a straight-chain dimethylpolysiloxane having at each molecular terminal a silicon-bonded alkoxysilyl-containing group having the structure:

(A2) a straight-chain dimethylpolysiloxane having at only one molecular terminal a silicon-bonded alkoxysilyl-containing group having the structure:

(B) 1 to 100 parts by mass of a straight chain dimethylpolysiloxane having a dimethylvinylsiloxy group bonded to silicon at both molecular terminals and lacking a hydroxyl group and an alkoxy group on a silicon atom in the molecular chain;

(C) 0.5 to 30 parts by mass of methyltrimethoxysilane;

(D) a condensation-reaction catalyst;

(E) an adhesion promoter; and

(F) a reinforcing filler.

2. The room-temperature-curable silicone rubber composition according to claim 1 , wherein a viscosity at 25° C. of the component (A) as a whole is in a range of 100 to 1,000,000 mPa s.

3. The room-temperature-curable silicone rubber composition according to claim 1 , wherein a viscosity at 25° C. of the component (B) is in a range of 10 to 1,000,000 mPas.

4. The room-temperature-curable silicone rubber composition according to claim 1 , wherein component (E) is selected from the group consisting of: epoxy group-containing alkoxysilanes, acrylic group-containing alkoxysilanes, amino group-containing alkoxysilanes, and reaction mixtures of epoxy group-containing alkoxysilanes and amino group-containing alkoxysilanes.

5. The room-temperature-curable silicone rubber composition according to claim 1 , wherein component (F) is selected from the group consisting of: fumed silica fine powder, precipitated silica fine powder, baked silica fine powder, and fumed titanium oxide fine powder.

6. A silicone rubber cured product which is obtained by curing the room-temperature-curable silicone rubber composition described in claim 1 .

7. An electronic device provided with the silicone rubber cured product described in claim 6 .

8. The room-temperature-curable silicone rubber composition according to claim 1 , wherein components (A1) and (A2) each have a viscosity at 25° C. of 500 mPas, and wherein component (B) has a viscosity at 25° C. of 400 mPas.

9. The room-temperature-curable silicone rubber composition according to claim 8 , further comprising (B2) a straight-chain dimethylpolysiloxane having a trimethylsiloxy group bonded to silicon at each molecular terminal.

10. The room-temperature-curable silicone rubber composition according to claim 9 , wherein the component (B2) has a viscosity at 25° C. of 500 mPa·s.

11. The room-temperature-curable silicone rubber composition according to claim 1 , further comprising (B2) a straight-chain dimethylpolysiloxane having a trimethylsiloxy group bonded to silicon at each molecular terminal.

12. The room-temperature-curable silicone rubber composition according to claim 11 , wherein the component (B2) has a viscosity at 25° C. of 500 mPa·s.

13. A room-temperature-curable silicone rubber composition comprising: (A) a mixture containing components (A1) and (A2) below:

(A1) a straight-chain dimethylpolysiloxane having a viscosity at 25° C. of 500 mPa·s and having at each molecular terminal a silicon-bonded alkoxysilyl-containing groups represented by general formula:

(A2) a straight-chain dimethylpolysiloxane having a viscosity at 25° C. of 500 mPa·s and at one molecular terminal one of the above alkoxysilyl-containing groups;

(B) a straight chain dimethylpolysiloxane having a viscosity at 25° C. of 400 mPa·s, a dimethylvinylsiloxy group bonded to silicon at both molecular terminals and lacking a hydroxyl group and an alkoxy group on a silicon atom in the molecular chain;

(B2) a straight-chain dimethylpolysiloxane having a viscosity at 25° C. of 500 mPa·s and a trimethylsiloxy group bonded to silicon at each molecular terminal

(C) methyltrimethoxysilane;

(D) a condensation-reaction catalyst;

(E) carbasilatrane; and

(F) fumed silica.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2019
From: DOW CORNING TORAY CO., LTD.
To: DOW TORAY CO., LTD.
Reel/Frame 051322/0925 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 21, 2016
From: KODAMA, HARUMI; ONISHI, MASAYUKI
To: DOW CORNING TORAY CO., LTD.
Reel/Frame 038974/0735 →
Priority Claims (1)
JP 2013-272670 · Dec 27, 2013 · national
Continuity (1)
Related Publication 20170029622A1 · Feb 2, 2017
Cited By (1)
US 12,378,363