IP Library Granted Patent US 10,139,300
Granted Patent B2
US 10,139,300 · App. 15/106,898 · Granted Nov 27, 2018

High pressure strain detection device with a base made of a first brittle material and a strain detection element bonded to the base via a second brittle material

Inventors: Masayuki Hio (Hitachinaka, JP); Mizuki Shibata (Hitachinaka, JP)
Assignee: Hitachi Automotive Systems, Ltd.
G01L9/0048G01L9/0051
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Quick Facts
Patent No.
US 10,139,300
App. No.
15/106,898
Granted
Nov 27, 2018
Kind
B2
Abstract

Provided is a pressure measuring device that can stably bond a strain detection element even to a diaphragm made of metal having a large coefficient of thermal expansion. In order to achieve the above object, the pressure measuring device of the present invention includes: a metal housing including a pressure introduction unit and a diaphragm deformed by a pressure introduced via the pressure introduction unit; and a strain detection element for detecting strain generated in the diaphragm, wherein a base made of a first brittle material is provided on the metal housing, and the strain detection element is bonded to the base via a second brittle material having a melting point lower than a melting point of the base.

Claims (11)

1. A pressure detection device, comprising: a metal housing including a pressure introduction unit and a diaphragm deformed by a pressure introduced via the pressure introduction unit; and a strain detection element for detecting strain generated in the diaphragm, wherein a base made of a first brittle material having a first melting point is provided on the metal housing, and the strain detection element is bonded to the base via a second brittle material having a second melting point that is lower than the first melting.

2. The pressure measuring device according to claim 1 , wherein a main component of the second brittle material is glass containing vanadium.

3. The pressure measuring device according to claim 1 , wherein the second melting point is equal to or lower than 400° C.

4. The pressure measuring device according to claim 3 , wherein the first melting point is equal to or higher than 800° C.

5. The pressure measuring device according to claim 1 , wherein

the strain detection element is subjected to anodic bonding with a glass substrate, and

the glass substrate is bonded to the base via the second brittle material.

6. The pressure measuring device according to claim 1 , wherein the base is formed by stacking a plurality of brittle materials having melting points equal to or higher than the second melting point, and at least one of the plurality of brittle materials has a solid shape at the second melting point.

7. The pressure measuring device according to claim 1 , wherein the base and/or the second brittle material is/are formed to have a circular shape.

8. The pressure measuring device according to claim 1 , wherein the base and/or the second brittle material is/are formed to have an n-gonal shape where n≥8.

9. The pressure measuring device according to claim 1 , wherein the first brittle material and the second brittle materials are materials that break in an elastic region.

Assignments (2)
CHANGE OF NAME Recorded Mar 25, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 056299/0447 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 21, 2016
From: HIO, MASAYUKI; SHIBATA, MIZUKI
To: HITACHI AUTOMOTIVE SYSTEMS, LTD.
Reel/Frame 038972/0939 →
Priority Claims (1)
JP 2013-266307 · Dec 25, 2013 · national
Continuity (1)
Related Publication 20170038269A1 · Feb 9, 2017