IP Library Granted Patent US 10,481,023
Granted Patent B2
US 10,481,023 · App. 15/107,246 · Granted Nov 19, 2019

Mechanical quantity measuring device and sensor unit

Inventors: Hanae Shimokawa (Tokyo, JP); Hiroyuki Oota (Tokyo, JP); Atsushi Kazama (Tokyo, JP); Shohei Hata (Tokyo, JP); Takuto Yamaguchi (Tokyo, JP); Atsuo Soma (Hitachinaka, JP); Kisho Ashida (Hitachinaka, JP); Junji Onozuka (Hitachinaka, JP); Kentarou Miyajima (Hitachinaka, JP); Masayuki Hio (Hitachinaka, JP)
Assignee: Hitachi Automotive Systems, Ltd.
G01L9/0048G01L19/04G01L19/147H01L2224/48091H01L2224/49171H01L2224/73265
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Quick Facts
Patent No.
US 10,481,023
App. No.
15/107,246
Granted
Nov 19, 2019
Kind
B2
Abstract

A mechanical quantity measuring device includes: a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector; a stem having ascot that protrudes from an adjacent peripheral portion and has an upper surface that is attached to a lower surface of the sensor chip by a bonding material formed from a metallic material or a glass material; a lead-out wiring part including a plurality of wires that are electrically connected to the plurality of electrodes; and a fixing part for fixing the stem, wherein: the stem and the fixing part are integrally molded or fixed through metallic bonding or mechanical bonding.

Claims (36)

1. A mechanical quantity measuring device comprising:

a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes;

a stem having a seat that protrudes from an adjacent peripheral portion and has an upper surface that is attached to a lower surface of the sensor chip by a bonding material formed from a metallic material or a glass material;

a lead-out wiring part including a plurality of wires that are electrically connected to the plurality of electrodes; and

a fixing part configured to fix the stem, wherein:

the stem and the fixing part are metallically bonded to one another,

the stem is a rectangular-shaped plate member,

the seat has a rectangular shape larger than the sensor chip, and

the sensor chip is bonded to the stem via the bonding material, the bonding material including solder containing Sn-3.5 wt %, Ag-0.5 wt %, or Au-20 wt %.

2. The mechanical quantity measuring device according to claim 1 , wherein:

the fixing part is an object to be measured that has a larger area than that of the stem and fixes the peripheral portion of the stem.

3. The mechanical quantity measuring device according to claim 2 , wherein:

a region in the stem where the seat is formed has higher rigidity than rigidity of the peripheral portion.

4. The mechanical quantity measuring device according to claim 1 , wherein:

a groove that is narrower than the seat and protrudes beyond an outer circumference of the seat is formed in a surface of the stem that is a reverse side of a surface to which the sensor chip is bonded.

5. The mechanical quantity measuring device according to claim 4 , wherein:

the groove is formed across the seat from its one side to its opposite side.

6. The mechanical quantity measuring device according to claim 5 , wherein:

the groove that extends across the seat is formed so that one end and another end of the groove do not extend beyond the peripheral portion of the stem.

7. The mechanical quantity measuring device according to claim 4 , wherein:

the stem has at least a pair of groove parts that is parallel to or perpendicular to the groove and is formed in the peripheral portion adjacent to the seat.

8. The mechanical quantity measuring device according to claim 4 , wherein:

the stem has a frame-like groove part that surrounds the seat and is formed in the peripheral portion adjacent to the seat.

9. The mechanical quantity measuring device according to claim 1 , wherein:

the fixing part is formed as a cylindrical pressure introducing part.

10. The mechanical quantity measuring device according to claim 9 , wherein:

the fixing part has an opening that exposes at least part of a surface of the stem that is a reverse side of a surface to which the sensor chip is bonded; and

the sensor chip measures pressure inside the cylindrical fixing part.

11. The mechanical quantity measuring device according to claim 9 , wherein:

a metal layer is formed at at least one of the upper surface of the seat and the lower surface of the sensor chip.

12. The mechanical quantity measuring device according to claim 9 , wherein:

the bonding material is formed so that its outer peripheral portion reaches at least part of an outer circumference of the seat.

13. The mechanical quantity measuring device according to claim 1 , wherein:

the seat is formed on the stem by means of film formation.

14. The mechanical quantity measuring device according to claim 1 , wherein:

a height of the seat from the adjacent peripheral portion is 300 μm or less.

Assignments (2)
CHANGE OF NAME Recorded Mar 25, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 056299/0447 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 22, 2016
From: SHIMOKAWA, HANAE; OOTA, HIROYUKI; KAZAMA, ATSUSHI; HATA, SHOHEI; YAMAGUCHI, TAKUTO; SOMA, ATSUO; ASHIDA, KISHO; ONOZUKA, JUNJI; MIYAJIMA, KENTAROU; HIO, MASAYUKI
To: HITACHI AUTOMOTIVE SYSTEMS, LTD.
Reel/Frame 038985/0944 →
Priority Claims (1)
JP 2014-015383 · Jan 30, 2014 · national
Continuity (1)
Related Publication 20170108390A1 · Apr 20, 2017