Semiconductor light emitting device with shaped substrate and method of manufacturing the same

1. A device comprising:

a substrate;

a semiconductor structure disposed on the substrate, the semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region;

wherein:

the substrate comprises a first sidewall and a second sidewall;

the first sidewall and second sidewall are disposed at different angles relative to a major surface of the semiconductor structure;

the first sidewall forms a right angle with the major surface of the semiconductor structure; and

light is extracted from the substrate through the second sidewall; and

a reflective layer disposed over the first sidewall, the reflective layer extending from the semiconductor structure to an interface between the first sidewall and the second sidewall.

2. The device of claim 1 wherein the second sidewall forms an acute angle with the major surface of the semiconductor structure.

3. The device of claim 1 wherein the second sidewall has a larger area than the first sidewall.

4. A device comprising:

a substrate comprising a first sidewall, a second sidewall, a first long edge, a second long edge, and a short edge connecting the first and second long edges, wherein the first sidewall is disposed along the first long edge and the second sidewall is disposed along the second long edge;

a semiconductor structure disposed on the substrate, the semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region, wherein the first sidewall and second sidewall are disposed at different angles relative to a major surface of the semiconductor structure, the first sidewall forms a right angle with the major surface of the semiconductor structure, and light is extracted from the substrate through the second sidewall; and

a reflective layer disposed over the first sidewall, the reflective layer extending from the semiconductor structure to an interface between the first sidewall and the short edge.

5. The device of claim 1 wherein the substrate has a thickness of at least 500 μm.

6. The device of claim 1 further comprising a wavelength converting layer disposed over the second sidewall.

7. A device comprising:

a substrate comprising a first sidewall and a second sidewall;

a semiconductor structure disposed on the substrate, the semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region;

wherein:

the first sidewall and second sidewall are disposed at different angles relative to a major surface of the semiconductor structure;

the first sidewall forms a right angle with the major surface of the semiconductor structure; and

the substrate and the semiconductor structure are disposed in a cavity in a mount, wherein the cavity is shaped to accommodate the substrate and the semiconductor structure, and wherein the second sidewall is parallel with a top surface of the mount.

8. The device of claim 7 further comprising:

a wavelength converting layer disposed over the second sidewall; and

a reflective layer disposed on a top surface of the mount surrounding the wavelength converting layer.

9. The device of claim 1 wherein the substrate and the semiconductor structure are a first substrate and a first semiconductor structure, the device further comprising:

a second substrate; and

a second semiconductor structure disposed on the second substrate, the second semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region;

wherein:

the second substrate comprises a third sidewall and a fourth sidewall;

the fourth sidewall and fourth sidewall are disposed at different angles relative to a major surface of the second semiconductor structure; and

the first sidewall of the first substrate faces the third sidewall of the second substrate.

10. The device of claim 1 wherein the first sidewall is textured.

11. The device of claim 1 wherein the first and second sidewall form part of a prismatoid.

12. A method comprising:

growing a semiconductor structure on a substrate, the semiconductor structure comprising a III-nitride light emitting layer disposed between an n-type region and a p-type region;

shaping the substrate to form a first sidewall and a second sidewall, wherein the first sidewall and the second sidewall are disposed at different angles relative to a major surface of the semiconductor structure, wherein the first sidewall forms a right angle with the major surface of the semiconductor structure; and

forming a reflective layer over the first sidewall extending from the semiconductor structure to an interface between the first sidewall and the second sidewall wherein light is extracted from the substrate through the second sidewall.

13. The method of claim 12 wherein shaping comprises etching the substrate after growing the semiconductor structure.

14. The method of claim 12 further comprising texturing the first sidewall.

15. The device of claim 4 wherein the substrate has a thickness of at least 500 μm.

16. The device of claim 4 further comprising a wavelength converting layer disposed over the second sidewall.

17. The device of claim 4 wherein the first sidewall is textured.

18. The device of claim 7 further comprising a reflective layer disposed on the first sidewall.