IP Library Granted Patent US 9,944,759
Granted Patent B2
US 9,944,759 · App. 15/114,456 · Granted Apr 17, 2018

Curable silicone composition, cured product therefrom, and optical semiconductor device

Inventors: Akito Hayashi (Ichihara, JP); Kazuhiro Nishijima (Ichihara, JP); Tomohiro Iimura (Ichihara, JP); Michitaka Suto (Ichihara, JP); Takashi Sagawa (Ichihara, JP); Akihiko Kobayashi (Ichihara, JP)
Assignee: DOW CORNING TORAY CO., LTD.
C08G77/44C08L83/04C09K11/025C09K11/7706H01L33/502H01L33/56C08G77/12C08G77/20C08G77/80C08G2190/00H01L2224/32245H01L2224/48091H01L2224/48227H01L2224/73265
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Quick Facts
Patent No.
US 9,944,759
App. No.
15/114,456
Granted
Apr 17, 2018
Kind
B2
Abstract

A curable silicone composition comprising: (A) an organopolysiloxane represented by the average unit formula: (R 1 3 SiO 1/2 ) x (R 2 2 SiO 2/2 ) y (R 3 SiO 3/2 ) z (R 1 are alkyl groups, alkenyl groups, aryl groups, or aralkyl groups; R 2 are alkyl groups or alkenyl groups; R 3 is an alkyl group, aryl group, or an aralkyl group, provided that, in a molecule, at least 0.5 mol % of R 1 to R 3 are the alkenyl groups, at least one of R 3 is the aryl group or the aralkyl group; and x, y and z are numbers satisfying: 0.01≤x≤0.5, 0.01≤y≤0.4, 0.1≤z≤0.9, and x+y+z=1); (B) a straight-chain organopolysiloxane having at least two alkenyl groups in a molecule; (C) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; and (D) a hydrosilylation reaction catalyst. A cured product exhibiting excellent dispersibility of phosphor and having crack resistance is formed.

Claims (17)

1. A curable silicone composition comprising:

(A) an organopolysiloxane represented by the average unit formula:

(R 1 3 SiO 1/2 ) x (R 2 2 SiO 2/2 ) y (R 3 SiO 3/2 ) z

in the formula, R 1 are the same or different, and are alkyl groups having from 1 to 12 carbon atoms, or alkenyl groups having from 2 to 12 carbon atoms; R 2 are the same or different, and are alkyl groups having from 1 to 12 carbon atoms or alkenyl groups having from 2 to 12 carbon atoms; R 3 is an aryl group having from 6 to 20 carbon atoms, or an aralkyl group having from 7 to 20 carbon atoms, provided that, in a molecule, at least 0.5 mol % of a total content of the groups represented by R 1 , R 2 , and R 3 are the alkenyl groups and x, y and z are numbers satisfying: 0.05≤x≤0.4, 0.1≤y≤0.4, 0.3≤z≤0.8, and x+y+z=1;

(B) from 0.1 to 40 parts by mass, relative to 100 parts by mass of component (A), of a straight-chain organopolysiloxane having at least two alkenyl groups in a molecule;

(C) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule, in an amount such that a content of the silicon atom-bonded hydrogen atoms contained in this component is from 0.1 to 10 mol relative to 1 mol of the total content of the alkenyl groups contained in components (A) and (B); and

(D) a hydrosilylation reaction catalyst, in an amount that accelerates curing of the composition.

2. The curable silicone composition according to claim 1 , wherein component (A) is an organopolysiloxane in which R 2 of the average unit formula are the same or different alkyl groups having from 1 to 12 carbon atoms.

3. The curable silicone composition according to claim 2 , wherein component (B) is a straight-chain organopolysiloxane having alkenyl groups bonded to silicon atoms on both molecular terminals.

4. The curable silicone composition according to claim 1 , wherein component (B) is a straight-chain organopolysiloxane having alkenyl groups bonded to silicon atoms on both molecular terminals.

5. The curable silicone composition according to claim 1 , further comprising (E) a hydrosilylation reaction inhibitor, in an amount of from 0.01 to 3 parts by mass per 100 parts by mass of the total amount of components (A) to (C).

6. The curable silicone composition according to claim 1 , further comprising (F) an adhesion-imparting agent, in an amount of from 0.1 to 5 parts by mass per 100 parts by mass of the total amount of components (A) to (C).

7. The curable silicone composition according to claim 1 , further comprising (G) a phosphor, in an amount of from 0.1 to 70% by mass relative to the total amount of components (A) to (C).

8. A cured product produced by curing the curable silicone composition according to claim 7 .

9. An optical semiconductor device comprising an optical semiconductor element sealed or coated with a cured product of the curable silicone composition according to claim 7 .

10. A cured product produced by curing the curable silicone composition according to claim 1 .

11. An optical semiconductor device comprising an optical semiconductor element sealed or coated with a cured product of the curable silicone composition according to claim 1 .

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2019
From: DOW CORNING TORAY CO., LTD.
To: DOW TORAY CO., LTD.
Reel/Frame 051322/0925 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 21, 2016
From: HAYASHI, AKITO; NISHIJIMA, KAZUHIRO; IIMURA, TOMOHIRO; SUTO, MICHITAKA; SAGAWA, TAKASHI; KOBAYASHI, AKIHIKO
To: DOW CORNING TORAY CO., LTD.
Reel/Frame 040082/0700 →
Priority Claims (1)
JP 2014-019702 · Feb 4, 2014 · national
Continuity (1)
Related Publication 20160347911A1 · Dec 1, 2016