IP Library Granted Patent US 10,291,079
Granted Patent B2
US 10,291,079 · App. 15/115,520 · Granted May 14, 2019

Wireless charging substrate and device

Inventors: Man Hue Choi (Seoul, KR); Hyun Gyu Park (Seoul, KR); Seok Bae (Seoul, KR); Sang Won Lee (Seoul, KR)
Assignee: LG INNOTEK CO., LTD.
H02J50/70H01F27/22H01F27/2804H01F27/2876H01F27/365H01F38/14H02J7/0042H02J7/025H02J7/027H02J50/10
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Quick Facts
Patent No.
US 10,291,079
App. No.
15/115,520
Granted
May 14, 2019
Kind
B2
Abstract

Provided is a wireless charging board including: a coil pattern; a soft magnetic layer having one side on which the coil pattern is disposed; and a heat dissipation layer disposed on the other side of the soft magnetic layer and including a first uneven pattern portion.

Claims (27)

1. A wireless charging board comprising:

a soft magnetic layer having a first surface and a second surface opposite to the first surface;

a coil pattern disposed on the first surface of the soft magnetic layer; and

a heat dissipation layer disposed on the second surface of the soft magnetic layer,

wherein the heat dissipation layer is in direct physical contact with the second surface of the soft magnetic layer such that the coil pattern, the soft magnetic layer, and the heat dissipation layer are stacked in series,

wherein a first uneven pattern portion is formed on a surface of the heat dissipation layer that is in direct physical contact with the second surface of the soft magnetic layer,

wherein a second uneven pattern portion is formed on the second surface of the soft magnetic layer, and

wherein a surface of the first uneven pattern portion and a surface of the second uneven pattern portion are in direct contact with each other.

2. The wireless charging board of claim 1 , wherein the first uneven pattern portion is disposed in a partial region or on an entire surface of the heat dissipation layer.

3. The wireless charging board of claim 2 , wherein the first uneven pattern portion is directly formed on the surface of the heat dissipation layer.

4. The wireless charging board of claim 3 , wherein the first uneven pattern portion has a structure in which embossed patterns and engraved patterns are mixed on the surface of the heat dissipation layer.

5. The wireless charging board of claim 4 , wherein cross-sectional shapes of the embossed patterns and the engraved patterns of the first uneven pattern portion are same.

6. The wireless charging board of claim 5 , wherein the first uneven pattern portion has a structure in which the embossed patterns and the engraved patterns are alternately disposed adjacent to each other.

7. The wireless charging board of claim 4 , wherein a width of a top surface of each of the embossed patterns is greater than a width of a bottom surface of each of the embossed patterns.

8. The wireless charging board of claim 4 , wherein a width of a bottom surface of each of the engraved patterns is greater than a width of a top surface of each of the engraved patterns.

9. The wireless charging board of claim 4 , wherein each of the embossed patterns and the engraved patterns has a height of 2 to 200 μm.

10. The wireless charging board of claim 5 , wherein a width of each of the embossed patterns and a width of each of the engraved patterns are the same.

11. The wireless charging board of claim 10 , wherein each of the embossed patterns and the engraved patterns has a width of 2 to 200 μm.

12. The wireless charging board of claim 4 , wherein cross-sectional shapes of the embossed patterns and the engraved patterns are different from each other.

13. The wireless charging board of claim 4 , wherein the embossed patterns and the engraved patterns having different cross-sectional shapes are alternately disposed.

14. The wireless charging board of claim 1 , wherein a cross-section of at least one of the first uneven pattern portion and the second uneven pattern portion comprises at least one pattern among circular and polygonal patterns.

15. The wireless charging board of claim 4 , wherein the soft magnetic layer is formed of one selected from a group consisting of an amorphous alloy, a crystalline alloy, an amorphous alloy ribbon, a nanocrystalline ribbon, and a silicon steel plate.

16. The wireless charging board of claim 4 , wherein the heat dissipation layer comprises a metal material.

17. The wireless charging board of claim 16 , wherein the metal material comprises at least one among nickel (Ni), iron (Fe), aluminum (Al), copper (Cu), tin (Sri), zinc (Zn), tungsten (W), and silver (Ag).

18. A wireless charging device comprising the wireless charging board of claim 1 .

19. The wireless charging board of claim 1 , wherein the surface of the first uneven pattern portion is engaged with the surface of the second uneven pattern portion.

20. The wireless charging board of claim 1 , wherein the first uneven pattern portion is mated with the second uneven pattern portion.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2024
From: SCRAMOGE TECHNOLOGY LIMITED
To: NERA INNOVATIONS LIMITED
Reel/Frame 066778/0214 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 18, 2021
From: LG INNOTEK CO., LTD.
To: SCRAMOGE TECHNOLOGY LIMITED
Reel/Frame 055335/0652 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2016
From: CHOI, MAN HUE; PARK, HYUN GYU; BAE, SEOK; LEE, SANG WON
To: LG INNOTEK CO., LTD.
Reel/Frame 039918/0385 →
Priority Claims (1)
KR 10-2014-0010993 · Jan 29, 2014 · national
Continuity (1)
Related Publication 20170179753A1 · Jun 22, 2017