Optoelectronic component

1. An optoelectronic component comprising a housing having a cavity in which an optoelectronic semiconductor chip having an emission face that emits light rays and a transparent potting material are arranged,

wherein the cavity comprises at least one side wall at least partly reflecting light rays incident on the side wall and reflectivity of which decreases as an operating period of the component increases,

conversion particles are embedded into the potting material, which conversion particles convert light rays having a first wavelength incident on the conversion particles into light rays having a second wavelength, and

scattering particles are embedded into the potting material, which scattering particles scatter light rays incident on the scattering particles and the scattering capability of which scattering particles increases as the operating period increases.

2. The optoelectronic component according to claim 1 , wherein the conversion particles are configured to convert incident light rays having a relatively short wavelength into light rays having a relatively long wavelength.

3. The optoelectronic component according to claim 1 , wherein the scattering particles are configured such that a temporal increase in scattering capability is dependent on an effect on the scattering particles manifested by short-wave electromagnetic radiation, UV radiation, and/or heat and/or moisture.

4. The optoelectronic component according to claim 1 , wherein the scattering particles are configured to develop hollow spaces or microscopic cracks, that increase the scattering capability as the operating period increases.

5. The optoelectronic component according to claim 1 , wherein the scattering particles comprise a silicone or a phenylsilicone.

6. The optoelectronic component according to claim 5 , wherein the potting material comprises a silicone or a methylsilicone, having a refractive index of lower than a refractive index of the silicone of the scattering particles.

7. The optoelectronic component according to claim 1 , wherein the potting material comprises a silicone or a methylsilicone.

8. The optoelectronic component according to claim 1 , wherein the scattering particles comprise a polymer or PMMA.

9. The optoelectronic component according to claim 1 , wherein the scattering particles are of multi-component design and

comprise a catalyst and a transparent encapsulation,

the encapsulation at least partly surrounds the catalyst, and

the catalyst is configured to support a decomposition of the encapsulation under influence of short-wave electromagnetic radiation, UV radiation, and/or heat and/or moisture.

10. The optoelectronic component according to claim 9 , wherein the catalyst comprises TiO 2 .

11. The optoelectronic component according to claim 9 , wherein the encapsulation comprises a polymer.

12. The optoelectronic component according to claim 1 , wherein the scattering particles comprise a size of 1 nm to 100 μm.

13. The optoelectronic component according to claim 1 , wherein concentration of the scattering particles in the potting material is chosen such that, as the operating period of the optoelectronic component increases, a change in an average path length of a photon in the potting material on account of the decrease in reflectivity of the side wall is counteracted by a simultaneous increase in the scattering capability of the scattering particles, and

the color locus of the radiation emitted by the optoelectronic component changes by at most 5% during a lifetime of the optoelectronic component.

14. The optoelectronic component according to claim 1 , wherein the housing comprises a plastic, a polyphthalamide or PCT.