Component mounting device

1. A component mounting device comprising:

a head unit that includes a rotary type head including a plurality of nozzles configured to suck a component;

a moving mechanism attached to the head unit, the moving mechanism configured to move the head unit in at least two directions;

a side camera attached to the head unit, the side camera configured to acquire a post-suction image by imaging a nozzle of the plurality of nozzles from a side of the nozzle after suction of the component and configured to acquire a pre-mounting image by imaging the nozzle from the side prior to mounting of the component after acquiring the post-suction image; and

processing circuitry operatively connected to the rotary type head, the moving mechanism, and the side camera, the processing circuitry configured to control the rotary type head and the moving mechanism to sequentially move the plurality of nozzles above a supply position of a component supply device as a target position so as to suck the component, configured to control the rotary type head to sequentially move the plurality of nozzles above a mounting position of a mounting target as the target position, and configured to control the rotary type head to mount the component on the mounting target,

wherein the processing circuitry is configured to determine a posture change of the component on the nozzle from after the suction of the component prior to the mounting of the component based on the post-suction image and the pre-mounting image.

2. The component mounting device according to claim 1 ,

wherein the processing circuitry is configured to determine positional deviation in a left and right direction of the component as the posture change based on a position in the left and right direction of the component with respect to the nozzle in the post-suction image and a position in the left and right direction of the component with respect to the nozzle in the pre-mounting image.

3. The component mounting device according to claim 1 ,

wherein the processing circuitry is configured to determine positional deviation in a rotation direction of the component as the posture change based on a length in the left and right direction of the component in the post-suction image and a length in the left and right direction of the component in the pre-mounting image.

4. The component mounting device according to claim 1 ,

wherein the processing circuitry is configured to determine positional deviation in a height direction of the component as the posture change based on a lower end position of the component in the post-suction image and a lower end position of the component in the pre-mounting image.

5. The component mounting device according to claim 1 , further comprising:

a lower camera positioned below a moving path of the moving mechanism, the lower camera configured to acquire a lower image by imaging from below the component which is sucked by the nozzle prior to acquisition of the pre-mounting image,

wherein the processing circuitry is configured to set a correction value according to an amount of positional deviation of the component with respect to the nozzle based on the lower image,

wherein the lower camera reacquires the lower image by reimaging the component from below in a case where it is determined that the posture change of the component exceeds a permissible range by the processing circuitry,

wherein the processing circuitry resets the correction value based on the reacquired lower image, and

wherein the processing circuitry controls the rotary type head and the moving mechanism such that the component is mounted after correction is performed based on the set correction value in a case where it is determined that the posture change of the component does not exceed the permissible range, and controls the rotary type head and the moving mechanism such that the component is mounted after correction is performed based on the reset correction value in a case where it is determined that the posture change of the component exceeds the permissible range.

6. The component mounting device according to claim 1 ,

wherein the processing circuitry rotatably controls the rotary type head intermittently at each predetermined angle such that the plurality of nozzles are sequentially moved to each target position,

wherein the side camera acquires the post-suction image by imaging the nozzle when the nozzle is at an immediately post-suction position advanced from the target position above the supply position by the predetermined angle, and acquires the pre-mounting image by imaging the nozzle when the nozzle is at an immediately pre-mounting position prior to the target position above the mounting position by the predetermined angle, and

wherein an orientation of the nozzle which is imaged at the immediately post-suction position and an orientation of the nozzle which is imaged at the immediately pre-mounting position are the same orientation.

7. The component mounting device according to claim 1 ,

wherein the side camera acquires an image after mounting by imaging the nozzle from the side after mounting of the component, and

wherein the processing circuitry is configured to determine whether the component is mounted on the mounting target by the nozzle based on the image after mounting.