Laterally diffused metal oxide semiconductor device and manufacturing method therefor
A laterally diffused metal oxide semiconductor device includes: a substrate ( 10 ); a buried layer region ( 32 ) in the substrate; a well region ( 34 ) on the buried layer region ( 32 ); a gate region on the well region; a source region ( 41 ) and a drain region ( 43 ) which are located at two sides of the gate region; and a super junction structure. The source region ( 41 ) is located in the well region ( 34 ); the drain region ( 34 ) is located in the super junction structure; the gate region comprises a gate oxide layer and a gate electrode on the gate oxide layer; and the super junction structure comprises a plurality of N-columns and P-columns, wherein the N-columns and the P-columns are alternately arranged in a direction which is horizontal and is perpendicular to the direction of a connecting line between the source region and the drain region, each N-column comprises a top-layer N-region ( 23 ) and a bottom-layer N-region which are butted vertically, and each P-column comprises a top-layer P-region ( 24 ) and a bottom-layer P-region which are butted vertically.
1. A laterally diffused metal oxide semiconductor device, comprising:
a substrate;
a buried layer region having a second doping type formed in the substrate;
a well region having the second doping type formed on the buried layer region;
a gate region formed on the well region;
a source region and a drain region having a first doping type located on both sides of the gate region; and
a super junction structure;
wherein the source region is located in the well region, the drain region is located in the super junction structure, the gate region comprises a gate oxide layer and a gate formed on the gate oxide layer, the first doping type and the second doping type are opposite conductivity types, the super junction structure comprises a plurality of N-columns and a plurality of P-columns, the plurality of N-columns and the plurality of P-columns are arranged alternately along a direction which is horizontal and is perpendicular to a connecting line between the source region and the drain region, each N-column comprises a top-layer N-region and a bottom-layer N-region which are butted vertically; each P-column comprises a top-layer P-region and a bottom-layer P-region which are butted vertically, and
wherein the N-column comprises an elongated N-column and a staggered N-column, the elongated N-column extends along a direction of the connecting line between the source region and the drain region, and the elongated N-columns are arranged alternately along the direction which is horizontal and is perpendicular to the connecting line between the source region and the drain region; the staggered N-column and the P-column are filled between adjacent two elongated N-columns; the staggered N-columns and the P-columns are arranged alternately along the direction of the connecting line between the source region and the drain region.
2. The laterally diffused metal oxide semiconductor device according to claim 1 , wherein the first doping type is N-type; and the second doping type is P-type.
3. The laterally diffused metal oxide semiconductor device according to claim 2 , further comprising a P-type body lead-out region located in the well region, wherein the body lead-out region is located at a side of the source region away from the drain region.
4. The laterally diffused metal oxide semiconductor device according to of claim 3 , wherein the N-column comprises an elongated N-column and a staggered N-column, the elongated N-column extends along a direction of the connecting line between the source region and the drain region, and the elongated N-columns are arranged alternately along the direction which is horizontal and is perpendicular to the connecting line between the source region and the drain region; the staggered N-column and the P-column are filled between adjacent two elongated N-columns; the staggered N-columns and the P-columns are arranged alternately along the direction of the connecting line between the source region and the drain region.
5. A method of manufacturing a laterally diffused metal oxide semiconductor device, comprising the following steps:
providing a substrate;
forming a buried layer region having a second doping type, a plurality of bottom-layer N-regions and a plurality of bottom-layer P-regions in the substrate, wherein the bottom-layer N-regions and the bottom-layer P-regions are arranged alternately along a first dimension direction in a dimensional coordinate system;
forming an epitaxial layer on the bottom-layer N-region, the bottom-layer P-region, and the buried layer by an epitaxial growth process;
performing impurity ion implantation into the epitaxial layer, and performing drive-in to form a top-layer N-region, a top-layer P-region, and a well region having a second doping type; wherein after drive-in, each top-layer N-region abuts a bottom-layer N-region vertically to form a N-column, each top-layer P-region abuts a bottom-layer P-region vertically to form a P-column, the well region abuts the buried layer region vertically;
forming a gate oxide layer and a gate on the well region; and
forming a source region and a drain region having a first doping type, and a body lead-out region having a second doping type, wherein the source region and the drain region are formed on both sides of the gate oxide layer, a direction of a connecting line between the source region and the drain region is a second dimension direction in the dimensional coordinate system,
wherein the N-column comprises an elongated N-column and a staggered N-column, the elongated N-column extends along the second dimension direction, the elongated N-columns are arranged alternately along the first dimension direction; the staggered N-column and the P-column are filled between adjacent two elongated N-columns; the staggered N-columns and the P-columns are arranged alternately along the second dimension direction.
6. The method according to claim 5 , wherein the first doping type is N-type; and the second doping type is P-type.
7. The method according to claim 5 , wherein the body lead-out region is located at a side of the source region away from the drain region.
8. The method according to claim 5 , wherein the two-dimensional coordinate system is a Cartesian coordinate system.
9. The method according to claim 5 , wherein during forming the epitaxial layer on the bottom-layer N-region, the bottom-layer P-region, and the buried layer by the epitaxial growth process, a doping type of the epitaxial layer is in consistent with a doping type of the substrate.
10. A laterally diffused metal oxide semiconductor device, comprising:
a substrate;
a buried layer region having a second doping type formed in the substrate;
a well region having the second doping type formed on the buried layer region;
a gate region formed on the well region;
a source region and a drain region having a first doping type located on both sides of the gate region; and
a super junction structure;
wherein the source region is located in the well region, the drain region is located in the super junction structure, the gate region comprises a gate oxide layer and a gate formed on the gate oxide layer, the first doping type and the second doping type are opposite conductivity types, the super junction structure comprises a plurality of N-columns and a plurality of P-columns, the plurality of N-columns and the plurality of P-columns are arranged alternately along a direction which is horizontal and is perpendicular to a connecting line between the source region and the drain region, each N-column comprises a top-layer N-region and a bottom-layer N-region which are butted vertically; each P-column comprises a top-layer P-region and a bottom-layer P-region which are butted vertically,
wherein the first doping type is N-type; and the second doping type is P-type, and
wherein the N-column comprises an elongated N-column and a staggered N-column, the elongated N-column extends along a direction of the connecting line between the source region and the drain region, and the elongated N-columns are arranged alternately along the direction which is horizontal and is perpendicular to the connecting line between the source region and the drain region; the staggered N-column and the P-column are filled between adjacent two elongated N-columns; the staggered N-columns and the P-columns are arranged alternately along the direction of the connecting line between the source region and the drain region.