IP Library Granted Patent US 10,435,600
Granted Patent B2
US 10,435,600 · App. 15/121,090 · Granted Oct 8, 2019

Epoxy resin compositions for pre-gel ovens

Inventors: Andreas Lutz (Galgenen, CH); Jeannine Flueckiger (Freienbach, CH); Benjamin Alexander Haag (Horgen, CH); Regina Ditschuneit (Stuttgart, DE)
Assignee: DOW GLOBAL TECHNOLOGIES LLC
C09J163/00B05D3/0272C09J5/06C09J9/00C09J11/08C09J2459/00C09J2463/00C09J2467/00
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,435,600
App. No.
15/121,090
Granted
Oct 8, 2019
Kind
B2
Abstract

An epoxy adhesive composition is provided that has superior wash-off resistance after pre-gelling, and may be used, for example, in manufacturing processes, for example, in the automobile industry. The composition also provides unique viscosity profile after pre-gelling to significantly reduce failure mode in subsequent processing steps. In preferred embodiments the adhesive composition comprises an epoxy type resin and a gelling agent selected from polyesterdiols and polyvinyl butyrals.

Claims (8)

1. A process for forming an adhesive bond, comprising

a) applying an adhesive composition to a joint of an article; then

b) heating the article with the applied adhesive composition in a pre-gel oven at a temperature of 110 to 120° C. for a period of 5 to 20 minutes to pre-gel the adhesive composition, wherein at 60° C. the pre-gelled adhesive composition exhibits a Casson complex viscosity greater than the Casson complex viscosity of the adhesive composition at 60° C. prior to step b), and the pre-gelled adhesive exhibits a Casson complex viscosity below 300 Pas at 80° C.;

c) immersing the article with the pre-gelled adhesive composition in at least one of a degreasing, phosphate or e-coat bath at a temperature of 40 to 60° C.;

and

d) then curing the adhesive composition by application of heat to form the adhesive bond at the joint of the article,

wherein the adhesive composition consists of at least one epoxy resin, 4.35 to 6 weight-% of dicyandiamide, a curing accelerator, 3 to 6 weight-%, based on the weight of the adhesive composition, of a gelling agent selected from a polyester diol having a molecular weight of 1000 to 5000 g/mol or a mixture of a polyester diol having a molecular weight of 1000 to 5000 g/mol and a polyamide having a molecular weight of 1000 to 5000, and optionally one or more of a toughener, a filler, a thixotropic agent, an adhesion promoter, a surfactant, or a wetting agent.

2. The process of claim 1 wherein the gelling agent is a mixture of a polyester diol having a molecular weight of 1000 to 5000 g/mol and a polyamide having a molecular weight of 1000 to 5000.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2024
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 069923/0030 →
CHANGE OF LEGAL ENTITY Recorded Sep 10, 2024
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 068907/0881 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2024
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
Reel/Frame 068922/0001 →
Continuity (2)
Provisional Application 61979042 · Apr 14, 2014
Related Publication 20170022402A1 · Jan 26, 2017