IP Library Granted Patent US 10,213,872
Granted Patent B2
US 10,213,872 · App. 15/123,146 · Granted Feb 26, 2019

Machining head and machining device

Inventors: Thomas Peters (Lenzburg, CH); Tobias Leuppi (Dottikon, CH); Andreas Gisler (Riet bei Neftenbach, CH)
Assignee: OERLIKON METCO AG, WOHLEN
B23K26/1462B23K26/144B23K37/003
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Quick Facts
Patent No.
US 10,213,872
App. No.
15/123,146
Granted
Feb 26, 2019
Kind
B2
Abstract

A processing head ( 1 ) for surface processing by means of a laser beam is disclosed. The processing head ( 1 ) comprises a through passage ( 2 ) for a laser having a longitudinal axis (A), at least one powder supply passage ( 3 ) and a cooling passage ( 4 ) for cooling the processing head ( 1 ). The processing head ( 1 ) is at least configured of two parts and comprises a body ( 5 ) and a sleeve ( 6 ). The sleeve ( 6 ) is suitable for the arrangement at the body ( 5 ). The through passage ( 2 ) of the laser and the powder feed channel ( 3 ) are configured in the body ( 5 ). The body ( 5 ) at least partly forms a first sidewall of the cooling passage ( 4 ). The sleeve ( 6 ) at least partly forms a second sidewall of the cooling passage ( 4 ).

Claims (26)

1. A processing head for laser beam surface processing, comprising:

a body having a longitudinal axis;

a sleeve positionable on the body;

a laser beam through passage located in the body;

at least one powder feed channel located in the body; and

a cooling passage defining a meandering cooling path around at least part of the through passage for cooling the processing head,

wherein the body is structured to at least partly form a first side wall of the cooling passage and the sleeve is structured to at least partly form a second sidewall of the cooling passage.

2. A processing head in accordance with claim 1 , wherein a first feed passage and a second feed passage are arranged in the body for the supply and discharge of a cooling medium to and from the cooling passage.

3. A processing head in accordance with claim 1 , further comprising at least one sealing element, wherein the processing head consists of the body, the sleeve and the at least one sealing element.

4. A processing head in accordance with claim 1 , wherein the cooling passage is configured as a cooling coil or as a cooling spiral.

5. A processing head in accordance with claim 1 , wherein the cooling passage is arranged in at least one of the body and the sleeve.

6. A processing head in accordance with claim 1 , further comprising a sealing element arranged in a region facing an outlet side of the laser beam in order to seal the cooling passage.

7. A processing head in accordance with claim 1 , wherein the body and the sleeve are configured to taper toward an outlet side of the laser beam, at least in a section.

8. A processing head in accordance with claim 7 , wherein the cooling passage is arranged at least partly in the tapering section.

9. A processing head in accordance with claim 2 , wherein the cooling passage has a first feed opening and a second feed opening structured for the supply and/or removal of a cooling medium, and wherein the first feed opening and the second feed opening are axially spaced apart from one another relative to the longitudinal axis.

10. A processing head in accordance with claim 9 , wherein the first feed opening is in flow communication with the first feed passage and the second feed opening is in flow communication with the second feed passage, and wherein the first feed passage and/or the second feed passage, at least in a section, and the powder supply passage are arranged at substantially a same angle of inclination with respect to the longitudinal axis.

11. A processing head in accordance with claim 1 , wherein the cooling passage is arranged at least one of in or along a surface of the body remote from the through passage.

12. A processing head in accordance with claim 1 , wherein at least one of the sleeve and in particular the body are produced substantially from a material having a thermal conductivity larger than 300 W/(m×K).

13. A processing unit for laser beam surface processing, comprising:

a processing head in accordance with claim 1 .

14. A processing head in accordance with claim 6 , wherein the sealing element comprises a sealing ring.

15. A processing head in accordance with claim 7 , wherein the taper toward the outlet side is a conical taper.

16. A processing head in accordance with claim 8 , wherein the cooling passage is arranged completely in the tapering section.

17. A processing head in accordance with claim 11 , wherein the at least one powder supply passage is arranged between the cooling passage and the through passage.

18. A processing head in accordance with claim 12 , wherein the thermal conductivity is larger than 340 W/(m×K).

19. A processing head in accordance with claim 12 , wherein the thermal conductivity is larger than 380 W/(m×K).

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 17, 2016
From: PETERS, THOMAS; LEUPPI, TOBIAS; GISLER, ANDREAS
To: OERLIKON METCO AG, WOHLEN
Reel/Frame 040360/0719 →
Priority Claims (1)
EP 14157566 · Mar 4, 2014 · regional
Continuity (1)
Related Publication 20170072510A1 · Mar 16, 2017