Mobile terminal
A mobile terminal is provided. The mobile terminal includes a circuit board, where a chip is disposed on a first surface of the circuit board. A groove is provided on a second surface of the circuit board. The mobile terminal further includes: a heat pipe that is disposed in the groove. One end of the heat pipe extends to a side wall of the circuit board or outside a side wall of the circuit board.
1. A mobile terminal, comprising a circuit board, wherein a chip is disposed on a first surface of the circuit board, a groove is provided on a second surface of the circuit board, and the mobile terminal further comprises:
a heat pipe, wherein the heat pipe is disposed in the groove, and one end of the heat pipe extends to a side wall of the circuit board or outside a side wall of the circuit board; and
a thermal pad, located in the groove, wherein the thermal pad is located between the chip and the heat pipe.
2. The mobile terminal according to claim 1 , wherein the groove extends to below the chip.
3. The mobile terminal according to claim 1 , wherein
a depth of the groove is less than or equal to half a thickness of the circuit board.
4. The mobile terminal according to claim 1 , wherein
the heat pipe has a rectangular section.
5. The mobile terminal according to claim 1 , further comprising:
a shielding case, located on the circuit board and wrapping the chip.
6. The mobile terminal according to claim 1 , further comprising:
a housing, wrapping the heat pipe, the shielding case, the chip, and the circuit board.
7. A method, comprising:
disposing a chip on a first surface of a circuit board in a mobile terminal;
forming a groove on a second surface of the circuit board;
disposing a heat pipe in the groove, wherein one end of the heat pipe extends to a side wall of the circuit board; and
disposing a thermal pad in the groove, wherein the thermal pad is located between the chip and the heat pipe.
8. The method according to claim 1 , wherein the groove extends to below the chip.
9. The method according to claim 1 , wherein a depth of the groove is less than or equal to half a thickness of the circuit board.
10. The method according to claim 1 , wherein the heat pipe has a rectangular section.
11. The method according to claim 1 , further comprising:
forming a shielding case, on the circuit board, wherein the shielding case wraps the chip.
12. The method according to claim 1 , further comprising:
forming a housing that wraps the heat pipe, the shielding case, the chip, and the circuit board.