IP Library Granted Patent US 9,947,850
Granted Patent B2
US 9,947,850 · App. 15/124,724 · Granted Apr 17, 2018

Substrate for light emitting devices and light emitting device

Inventors: Masahiro Konishi (Sakai, JP); Shin Itoh (Sakai, JP); Hiroyuki Nokubo (Sakai, JP); Yoshiaki Itakura (Sakai, JP)
Assignee: Sharp Kabushiki Kaisha
H01L33/642H01L25/0753H01L33/56H01L33/60H01L33/62H01L33/641H05K1/053F21K9/00F21V29/773F21Y2105/10F21Y2115/10H01L2224/16225H01L2933/005H01L2933/0058H01L2933/0066H01L2933/0075H05K3/44H05K2201/0179H05K2201/10106
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Quick Facts
Patent No.
US 9,947,850
App. No.
15/124,724
Granted
Apr 17, 2018
Kind
B2
Abstract

In order to provide a substrate for light emitting devices having high heat radiating properties, dielectric strength voltage properties, light reflectivity, and excellent mass productivity, a substrate ( 5 ) includes an intermediate layer ( 11 ) containing ceramic which is formed on the surface of the aluminum base ( 10 ) by using an aerosol deposition method.

Claims (36)

1. A substrate for light emitting devices, comprising:

a base containing a metal material;

a first insulating layer which is formed on one surface of the base; and

a wiring pattern which is formed on the first insulating layer, wherein

the first insulating layer is formed of ceramic which is formed by using an aerosol deposition method,

a buffer layer formed of a material having a coefficient of linear expansion smaller than that of the base is formed between the base and the first insulating layer, and

the first insulating layer has thermal conductivity and contains an additive of an inorganic material for improving brightness.

2. A substrate for light emitting devices, comprising:

a base containing a metal material;

a first insulating layer which is formed on one surface of the base;

a wiring pattern which is formed on the first insulating layer,

a second insulating layer having thermal conductivity and light reflectivity which is formed between the first insulating layer and the wiring pattern, wherein

the first insulating layer is formed of ceramic which is formed by using an aerosol deposition method,

a buffer layer formed of a material having a coefficient of linear expansion smaller than that of the base is formed between the base and the first insulating layer,

the first insulating layer has thermal conductivity,

the second insulating layer contains ceramic which is formed by using the aerosol deposition method, and

the second insulating layer further contains an additive of an inorganic material for improving brightness which is formed by using the aerosol deposition method and which is contained in the second insulating layer and is entirely ceramic having high brightness.

3. A substrate for light emitting devices, comprising:

a base containing a metal material;

a first insulating layer which is formed on one surface of the base; and

a wiring pattern which is formed on the first insulating layer,

a second insulating layer having light reflectivity which is formed between the first insulating layer and the wiring pattern, wherein

the first insulating layer is formed of ceramic which is formed by using an aerosol deposition method,

a buffer layer formed of a material having a coefficient of linear expansion smaller than that of the base is formed between the base and the first insulating layer,

the first insulating layer has thermal conductivity and reinforces dielectric strength voltage properties of the second insulating layer, and

the thermal conductivity of the first insulating layer is higher than the thermal conductivity of the second insulating layer, and

the second insulating layer is a mixed layer of ceramic and a vitreous matter or a mixed layer of ceramic and a resin.

4. A substrate for light emitting devices, comprising:

a base containing a metal material;

a first insulating layer having light reflectivity which is formed on one surface of the base;

a second insulating layer having thermal conductivity which is formed on the other surface of the base; and

a wiring pattern which is formed on the first insulating layer, wherein

the second insulating layer is formed of ceramic which is formed by using an aerosol deposition method and reinforces dielectric strength voltage properties of the first insulating layer,

a buffer layer formed of a material having a coefficient of linear expansion smaller than that of the base is formed between the base and the first insulating layer,

the thermal conductivity of the first insulating layer is higher than the thermal conductivity of the second insulating layer, and

the second insulating layer is a mixed layer of ceramic and a vitreous matter or a mixed layer of ceramic and a resin.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2025
From: SHARP KABUSHIKI KAISHA
To: SHARP FUKUYAMA LASER CO., LTD.
Reel/Frame 071863/0508 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2016
From: KONISHI, MASAHIRO; ITOH, SHIN; NOKUBO, HIROYUKI; ITAKURA, YOSHIAKI
To: SHARP KABUSHIKI KAISHA
Reel/Frame 039683/0378 →
Priority Claims (2)
JP 2014-078142 · Apr 4, 2014 · national
JP 2014-089621 · Apr 23, 2014 · national
Continuity (1)
Related Publication 20170018697A1 · Jan 19, 2017