IP Library Granted Patent US 11,004,177
Granted Patent B2
US 11,004,177 · App. 15/125,221 · Granted May 11, 2021

Image processing device and board production system

Inventors: Kazuya Kotani (Toyota, JP); Shuichiro Kito (Toyota, JP)
Assignee: FUJI CORPORATION
G06T3/4053G06T7/0004H04N1/19594H05K13/081G06T2207/10004G06T2207/20008G06T2207/30141
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Quick Facts
Patent No.
US 11,004,177
App. No.
15/125,221
Granted
May 11, 2021
Kind
B2
Abstract

An image processing device capable of reducing the load of image processing while shortening the time required for the image processing which uses super-resolution processing. The image processing device includes a process determination section which determines an execution necessity of the super-resolution processing in relation to image data during execution of a production process for every type of target object, a super-resolution processing section which executes the super-resolution processing which uses a plurality of items of the image data according to determination results of the process determination section to generate high resolution data, and a state recognition section which recognizes a state of the target object based on, of the image data and the high resolution data, the one corresponding to the determination results of the process determination section.

Claims (31)

1. An image processing device, comprising:

circuitry configured to, for each target object of a plurality of target objects:

acquire image data obtained by imaging the target object at imaging positions at a plurality of locations different from each other by a camera of an auxiliary device external to a component mounting machine adapted to control mounting of the plurality of target objects, each of the target objects being one of a plurality of electronic components to be mounted onto a board using the component mounting machine;

perform low-resolution processing using low resolution data from the image data acquired at only one of the imaging positions;

perform high-resolution processing using high resolution data obtained by super-resolution processing from the image data acquired at all of the imaging positions;

generate part data of the target object using the high resolution data;

recognize a position of the target object in the low resolution data based on the low-resolution processing;

recognize the position of the target object in the high resolution data based on the high-resolution processing;

compare the position of the target object in the high resolution data and the position of the target object in the low resolution data; and

set, as process management data for each type of the target object, an execution of the super-resolution processing as necessary for future processing, by the component mounting machine, of objects of the type of the target object when the position of the target object in the low resolution data falls outside a range of an allowable error in relation to the position of the target object in the high resolution data, otherwise set the execution of the super-resolution processing as unnecessary for future processing, by the component mounting machine, of objects of the type of the target object when the position of the target object in the low resolution falls within the range of the allowable error in relation to the position of the target object in the high resolution data.

2. The image processing device according to claim 1 , wherein the circuitry is further configured to:

determine whether a resolution of image data of a production object is suitable for determining a state of the production object based on a type of the production object and the process management data;

execute the super-resolution processing of generating high-resolution data from the image data of the production product when it is determined that the resolution of the image data of the production object is not suitable for determining the state of the production object, otherwise do not execute the super-resolution processing when it is determined that the resolution of the image data of the production object is suitable for determining the state of the production object; and

determine the state of the object by selective use of the high-resolution data of the production object based on the determination as to whether resolution of the image data of the production object is suitable or not for determining the state of the production object.

3. The image processing device according to claim 2 , wherein

the circuitry is further configured to generate the part data including an external shape of the electronic component based on imaging of the electronic component.

4. The image processing device according to claim 2 , wherein

a processing level indicating a degree of the super-resolution processing is set for the target object in the process management data, and

the circuitry is further configured to:

acquire the processing level corresponding to the type of the production object from the process management data during the execution of the super-resolution processing of the image data of the production product, and

generate the high resolution data of the image data of the production product which satisfies the processing level through the super-resolution processing.

5. The image processing device according to claim 4 , wherein the processing level is defined using a number of the imaging positions which are used in the super-resolution processing.

6. The image processing device according to claim 2 , wherein

the image processing device is applied to a production facility,

the production facility is the component mounting machine which mounts the electronic components onto the board, and

the production object is one of a plurality of electronic components which is held by a holding device of the component mounting machine.

7. A board production system, comprising:

the image processing device according to claim 6 ; and

circuitry configured to optimize mounting data, in which a mounting order of the electronic components is determined based on coordinates on the board onto which the electronic components are to be mounted and the determination result of whether the resolution of the image data of the production object is suitable for determining the state of the production object.

8. The image processing device according to claim 2 , wherein

the circuitry is further configured to switch execution of super-resolution processing to low-resolution processing when is determined that the resolution of the image data of the production object is suitable for determining the state of the production object.

Assignments (2)
CHANGE OF NAME Recorded Jul 19, 2018
From: FUJI MACHINE MFG. CO., LTD.
To: FUJI CORPORATION
Reel/Frame 046591/0109 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 12, 2016
From: KOTANI, KAZUYA; KITO, SHUICHIRO
To: FUJI MACHINE MFG. CO., LTD.
Reel/Frame 039696/0985 →
Continuity (1)
Related Publication 20170069057A1 · Mar 9, 2017