Solution for forming function layer contained in organic light emitting element and method for manufacturing organic light emitting element
A solution contains a functional material for constituting a function layer, and a solvent. The solvent contains a high-boiling-point solvent composed of one or more solvent components having a boiling point of not less than 200° C. The high-boiling-point solvent has a viscosity of from 13 mPa·s to 25 mPa·s, inclusive, and a surface tension of from 33 mN/m to 37 mN/m, inclusive.
1. A solution, comprising:
a functional material that constitutes a function layer of an organic light emitting element; and
a solvent that contains a high-boiling-point solvent, wherein the high-boiling-point solvent is composed of at least one first solvent component having a boiling point greater than or equal to 200° C., and wherein the high-boiling-point solvent has a viscosity in a range from 13 mPa·s to 25 mPa·s, and a surface tension in a range from 33 mN/m to 37 mN/m.
2. The solution according to claim 1 , wherein the viscosity of the high-boiling-point solvent is greater than 15 mPa·s.
3. The solution according to claim 1 , wherein the at least one first solvent component constituting the high-boiling-point solvent comprises a high-viscosity solvent having a viscosity greater than or equal to 20 mPa·s, and a proportion of the high-viscosity solvent in the high-boiling-point solvent is greater than or equal to 35 vol %.
4. The solution according to claim 3 , wherein the proportion of the high-viscosity solvent in the high-boiling-point solvent is greater than or equal to 50 vol %.
5. The solution according to claim 1 , wherein the solvent further contains a low-boiling-point solvent composed of at least one second solvent component having a boiling point lower than 200° C., and the viscosity of the solution is in a range from 5 mPa·s to 15 mPa·s.
6. The solution according to claim 5 , wherein the at least one second solvent component constituting the low-boiling-point solvent has a boiling point greater than 160° C.
7. The solution according to claim 1 , wherein the solvent further contains a low-boiling-point solvent composed of at least one second solvent component having a boiling point lower than 200° C., and a proportion of the high-boiling-point solvent in the solvent is lower than 80%.
8. The solution according to claim 7 , wherein the proportion of the high-boiling-point solvent in the solvent is lower than 60%.
9. A method of manufacturing an organic light emitting element, the method comprising:
forming a first electrode;
applying a solution containing a functional material and a solvent to a side of the first electrode;
drying the applied solution to form a function layer composed of the functional material over the first electrode; and
forming a second electrode over the function layer,
wherein the solvent contains a high-boiling-point solvent composed of at least one first solvent component having a boiling point greater than or equal to 200° C., and the high-boiling-point solvent has a viscosity in a range from 13 mPa·s to 25 mPa·s, and a surface tension in a range from 33 mN/m to 37 mN/m.
10. The method according to claim 9 , wherein the viscosity of the high-boiling-point solvent is greater than 15 mPa·s.
11. The method according to claim 9 , wherein the at least one first solvent component constituting the high-boiling-point solvent comprises a high-viscosity solvent having a viscosity greater than or equal to 20 mPa·s, and a proportion of the high-viscosity solvent in the high-boiling-point solvent is greater than or equal to 35 vol %.
12. The method according to claim 11 , wherein the proportion of the high-viscosity solvent in the high-boiling-point solvent is greater than or equal to 50 vol %.
13. The method according to claim 9 , wherein the solvent further contains a low-boiling-point solvent composed of at least one second solvent component having a boiling point lower than 200° C., and the viscosity of the solution is in a range from 5 mPa·s to 15 mPa·s.
14. The method according to claim 13 , wherein the at least one second solvent component constituting the low-boiling-point solvent has a boiling point greater than 160° C.
15. The method according to claim 9 , wherein the solvent further contains a low-boiling-point solvent composed of at least one second solvent component having a boiling point lower than 200° C., and a proportion of the high-boiling-point solvent in the solvent is lower than 80%.
16. The method according to claim 15 , wherein the proportion of the high-boiling-point solvent in the solvent is lower than 60%.