Multilayer printed circuit board with switching power supply capacitors, broad patterns, and TT-type filter
A multilayer printed circuit board includes a plurality of wire layers and mounted with a switching power supply, wherein at least three broad patterns, which are formed on at least three wire layers, and a via for connecting the at least three broad patterns are provided to a power supply path connecting a connector, which is to be connected to an external power supply, and the switching power supply, a first capacitor is connected to the connector-side broad pattern, a second capacitor is connected to the switching power supply-side broad pattern, and a π-type filter is configured with parasitic inductance, which is generated by the at least three broad patterns and the via, the first capacitor, and the second capacitor.
1. A multilayer printed circuit board comprising a plurality of wire layers and mounted with a switching power supply, wherein at least three broad patterns, which are formed on at least three wire layers, and a via for connecting the at least three broad patterns are provided to a power supply path connecting a connector, which is to be connected to an external power supply, and the switching power supply, a first capacitor is connected to the connector-side broad pattern, a second capacitor is connected to the switching power supply-side broad pattern, and a π-type filter is configured with parasitic inductance, which is generated by the at least three broad patterns and the via, the first capacitor, and the second capacitor.
2. The multilayer printed circuit board according to claim 1 , wherein the via is configured from a plurality of vias.
3. The multilayer printed circuit board according to claim 1 , wherein a first via for connecting the broad pattern formed on a surface layer and the broad pattern formed on an inner layer wire layer and a second via for connecting the broad pattern formed on the inner layer wire layer and the broad pattern formed on a back layer are provided.
4. The multilayer printed circuit board according to claim 3 , wherein the first via and the second via are each configured from a plurality of vias.
5. The multilayer printed circuit board according to claim 3 , wherein the switching power supply and the second capacitor are connected to the broad pattern formed on the surface layer, and the first capacitor is connected to the broad pattern formed on the back layer.
6. The multilayer printed circuit board according to claim 2 , wherein a third via for connecting the broad pattern formed on the back layer and a solid filling of an inner layer power supply layer is provided.
7. The multilayer printed circuit board according to claim 6 , wherein the third via is configured from a plurality of vias.
8. A server device mounted with the multilayer printed circuit board according to claim 1 .