Optoelectronic component and method for producing an optoelectronic component
An optoelectronic component may include a carrier, above which a first electrode is formed. An optically functional layer structure is formed above the first electrode. A second electrode is formed above the optically functional layer structure, the second electrode extending areally over at least one part of the side of the optically functional layer structure which faces away from the carrier. An encapsulation is formed above the first and/or second electrode, the encapsulation encapsulating the optically functional layer structure. An electrically conductive contact structure is arranged in a cutout of the encapsulation on the first and/or second electrode and extends through the encapsulation, for electrically contacting the first and/or second electrode. The contact structure and the encapsulation are formed such that in interaction they encapsulate the first and/or second electrode.
1. A method for producing an optoelectronic component, wherein
a carrier is provided,
a first electrode is formed above the carrier,
an optically functional layer structure is formed above the first electrode,
a second electrode is formed above the optically functional layer structure such that the second electrode extends areally over at least one part of the side of the optically functional layer structure which faces away from the carrier,
at least one part of an electrically conductive contact structure is formed on the first electrode and/or second electrode directly above the optically functional layer structure,
an encapsulation layer is formed above the first and/or second electrode and the contact structure such that the encapsulation layer encapsulates the optically functional layer structure, the first and/or second electrode and the contact structure, and
the contact structure is partly freed of the encapsulation layer such that the contact structure forms an electrically conductive connection to the first and/or second electrode through the encapsulation, wherein the contact structure is formed such that the contact structure projects from the encapsulation layer after the contact structure has been freed of the encapsulation layer.
2. The method as claimed in claim 1 , wherein the first and/or second electrode is encapsulated by the contact structure and the encapsulation in interaction.
3. The method as claimed in claim 1 , wherein a conductor track structure is formed above the encapsulation and is electrically coupled to the contact structure.
4. The method as claimed in claim 1 , wherein, above the first and/or second electrode, two, three or more of the contact structures are arranged in a distributed fashion above the first and/or second electrode.
5. The method as claimed in claim 1 , wherein a plurality of optoelectronic components are produced in the component assemblage, wherein the carrier extends over a plurality of the optoelectronic components, the optically functional layer structures, the electrodes, the contact structures and the encapsulations of the optoelectronic components are formed in the component assemblage and the optoelectronic components are subsequently singulated.
6. A method for producing an optoelectronic component, wherein
a carrier is provided,
a first electrode is formed above the carrier,
an optically functional layer structure is formed above the first electrode,
a second electrode is formed above the optically functional layer structure such that the second electrode extends areally over at least one part of the side of the optically functional layer structure which faces away from the carrier,
at least one part of an electrically conductive contact structure is formed on the first and/or second electrode by virtue of a first contact element of the contact structure being formed on the first and/or second electrode,
an encapsulation layer is formed above the first and/or second electrode and the contact structure such that the encapsulation layer encapsulates the optically functional layer structure, the first and/or second electrode and the contact structure, and
a further contact element of the contact structure is moved through the encapsulation layer such that the further contact element pierces the encapsulation layer until the further contact element physically and electrically contacts the first contact element, such that the contact structure forms an electrically conductive connection through the encapsulation layer.