Optoelectronic component and method for producing optoelectronic semiconductor components
What is specified is: an optoelectronic semiconductor component ( 1 ) comprising a carrier ( 5 ) and a semiconductor body ( 2 ), wherein the semiconductor body is fastened on the carrier and has a semiconductor layer sequence having an active region ( 20 ) provided for generating and/or receiving radiation, a first semiconductor layer ( 21 ) and a second semiconductor layer ( 22 ). The active region is arranged between the first semiconductor layer and the second semiconductor layer. The carrier is electrically conductive and is divided into a first carrier body ( 51 ) and a second carrier body ( 52 ), wherein the first carrier body and the second carrier body are electrically insulated from one another. The first carrier body has a first external contact ( 61 ) of the semiconductor component on the side remote from the semiconductor body, wherein the first contact is electrically conductively connected to the first semiconductor layer via the first carrier body. The second carrier body has a second external contact ( 62 ) of the semiconductor component on the side remote from the semiconductor body, wherein the second contact is electrically conductively connected to the second semiconductor layer via the second carrier body. The invention furthermore relates to a method for producing semiconductor components.
1. An optoelectronic semiconductor component with a carrier and a semiconductor body, wherein:
the semiconductor body is fastened to the carrier and comprises a semiconductor layer sequence with an active region provided for generating and/or receiving radiation, a first semiconductor layer and a second semiconductor layer;
the active region is arranged between the first semiconductor layer and the second semiconductor layer;
the carrier is electrically conductive and divided into a first carrier body and a second carrier body, the first carrier body and the second carrier body being electrically insulated from one another;
the first carrier body comprises a first external contact of the optoelectronic semiconductor component on the side facing away from the semiconductor body, the first external contact being electrically conductively connected to the first semiconductor layer via the first carrier body;
the second carrier body comprises a second external contact of the optoelectronic semiconductor component on the side facing away from the semiconductor body, the second external contact being electrically conductively connected to the second semiconductor layer via the second carrier body; and
the first carrier body and the second carrier body are separated from one another by an isolation trench.
2. The optoelectronic semiconductor component according to claim 1 , wherein the first carrier body and the second carrier body in a top view of the optoelectronic semiconductor component cover at least 80% of a base area of the optoelectronic semiconductor component.
3. The optoelectronic semiconductor component according to claim 1 , wherein the first carrier body and the second carrier body in a rear view of the optoelectronic semiconductor component together cover at least 80% of the semiconductor body.
4. The optoelectronic semiconductor component according to claim 1 , wherein
the first semiconductor layer is arranged on the side of the active region facing away from the carrier;
the semiconductor body comprises at least one recess, which extends through the second semiconductor layer and the active region into the first semiconductor layer; and
a first connection layer is arranged in the at least one recess, which layer is electrically conductively connected to the first semiconductor layer.
5. The optoelectronic semiconductor component according to claim 1 , wherein the second semiconductor layer is electrically conductively connected to a second connection layer and the second connection layer comprises at least one cut-out, in which the first semiconductor layer is connected to the first carrier body of the carrier via the first connection layer.
6. The optoelectronic semiconductor component according to claim 1 , wherein the isolation trench is filled with electrically insulating filler material.
7. The optoelectronic semiconductor component according to claim 1 , wherein the carrier is metallic.
8. The optoelectronic semiconductor component according to claim 1 , wherein a thermal expansion coefficient of the carrier deviates from the thermal expansion coefficient of the semiconductor body by 50% at most.
9. An optoelectronic semiconductor component with a carrier and a semiconductor body, wherein:
the semiconductor body is fastened to the carrier and comprises a semiconductor layer sequence with an active region provided for generating and/or receiving radiation, a first semiconductor layer and a second semiconductor layer, wherein
the active region is arranged between the first semiconductor layer and the second semiconductor layer;
the carrier is electrically conductive and divided into a first carrier body and a second carrier body, the first carrier body and the second carrier body being electrically insulated from one another;
the first carrier body comprises a first external contact of the optoelectronic semiconductor component on the side facing away from the semiconductor body, the first external contact being electrically conductively connected to the first semiconductor layer via the first carrier body;
the second carrier body comprises a second external contact of the optoelectronic semiconductor component on the side facing away from the semiconductor body, the second external contact being electrically conductively connected to the second semiconductor layer via the second carrier body;
the second semiconductor layer is connected to the second carrier body via a second connection layer;
the second connection layer comprises a plurality of cut-outs, the first semiconductor layer being connected to the first carrier body via a first connection layer in the cut-outs;
all cut-outs run inside the first carrier body in a top view of the optoelectronic semiconductor component; and
the first carrier body and the second carrier body are separated from one another by an isolation trench.