IP Library Granted Patent US 10,725,601
Granted Patent B2
US 10,725,601 · App. 15/127,496 · Granted Jul 28, 2020

Touch sensor

Inventors: Yuta Ohsawa (Saitama, JP); Yoshifumi Honmatsu (Saitama, JP)
Assignee: SEKISUI POLYMATECH CO., LTD.
G06F3/045G06F3/044H03K17/9622G06F2203/04103H03K2217/96078H03K2217/960755H03K2217/960765
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,725,601
App. No.
15/127,496
Granted
Jul 28, 2020
Kind
B2
Abstract

A touch sensor includes a sensor sheet that includes a plurality of sensor electrodes, wires that extend from the sensor electrodes, and a connection portion for connection to a substrate. The sensor sheet is formed with a body portion in which the sensor electrodes are formed, and a tail portion that projects from the body portion and that includes a terminal. A protective layer is stacked on at least a part of the tail portion. A folded portion in which the sensor sheet has been bent permanently is formed in the tail portion on which the protective layer is stacked.

Claims (26)

1. A touch sensor comprising;

a sensor sheet that has a plurality of sensor electrodes,

wires that extend from the sensor electrodes to the tail portion,

a resist layer formed on the sensor sheet configured to protect the sensor electrodes and the wires, and

wherein the sensor sheet has

a body portion in which the sensor electrodes are formed,

a tail portion

in which the wires are formed,

in which the sensor electrodes do not exist,

which is located directly under the body portion in a folded state, and

which has a connection portion at an end of the tail portion,

a widened portion which is extended and widened from the tail portion towards the body portion, and which has a folding line to fold the body portion with the sensor electrodes over the tail portion,

an air space between the body portion and the tail portion in the folded state, and

a protective layer formed only on the widened portion in which the sensor sheet is bent permanently along the folding line.

2. The touch sensor according to claim 1 , wherein the protective layer is provided at a position at which the protective layer does not overlap the wires, wherein the widened portion is provided transversely configured not to pass the wires.

3. The touch sensor according to claim 1 , wherein the protective layer is provided at a position at which the protective layer overlaps the wires.

4. The touch sensor according to claim 1 , wherein-the widened portion is formed at the tail portion, wider than the connection portion and narrower than the electrode formation portion, widened radially from the connection portion toward the electrode formation portion.

5. The touch sensor according to claim 1 , wherein the protective layer is constituted of a resin film.

6. The touch sensor according to claim 1 , wherein the protective layer has a thickness of 50 μm to 75 μm.

7. The touch sensor according to claim 1 , wherein at least the sensor electrodes, the connection portion, and the wires are provided on each of one surface and the other surface of the sensor sheet.

8. An electronic device comprising a housing and the touch sensor according to claim 1 provided inside the housing.

9. The touch sensor according to claim 1 , wherein the protective layer is provided externally on the folded portion.

10. The touch sensor according to claim 1 , wherein the protective layer is provided internally on the folded portion.

11. The touch sensor according to claim 1 , wherein the widened portion has a different width from either of the tail portion and the body portion.

12. The touch sensor according to claim 1 , wherein the widened portion is narrower than the body portion and wider than the tail portion.

13. The touch sensor according to claim 1 , wherein the space is formed for an amount corresponding to a thickness of the protective layer on an inner side of the wires.

Assignments (2)
CHANGE OF NAME Recorded Jun 1, 2018
From: POLYMATECH JAPAN CO., LTD.
To: SEKISUI POLYMATECH CO., LTD.
Reel/Frame 045964/0914 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2016
From: OHSAWA, YUTA; HONMATSU, YOSHIFUMI
To: POLYMATECH JAPAN CO., LTD.
Reel/Frame 040088/0431 →
Priority Claims (1)
JP 2014-068869 · Mar 28, 2014 · national
Continuity (1)
Related Publication 20170139511A1 · May 18, 2017