Analyte sensor transmitter unit configuration for a data monitoring and management system
Method and system for providing analyte sensor alignment and retention mechanism for improved connectivity with a transmitter unit for electrical connection, and further including transmitter unit contact pins with metal components to improve electrical conductivity with the analyte sensor in an analyte monitoring and management system is provided.
1. A method of applying an electronic device to the body of a user, the method comprising:
applying a sensor electronics mount to a skin surface of the user;
inserting, with an insertion mechanism, a sensor device into the sensor electronics mount to place at least a portion of an analyte sensor in fluid contact with a bodily fluid, wherein the sensor electronics mount includes a spring biased retaining mechanism configured to hold the analyte sensor relative to the sensor electronics mount;
removing the insertion mechanism from the sensor electronics mount; and
applying a transmitter housing to the sensor electronics mount.
2. The method of claim 1 , wherein the sensor electronics mount further includes an opening to detachably couple to the transmitter housing when the analyte sensor is connected to the sensor electronics mount.
3. The method of claim 1 , wherein the spring biased retaining mechanism includes a plurality of clip portions.
4. The method of claim 1 , wherein the analyte sensor includes a plurality of conductive pads and the transmitter housing includes a plurality of electrical contacts, and wherein the spring biased retaining mechanism is further configured to bias the plurality of conductive pads toward the corresponding plurality of electrical contacts.
5. The method of claim of claim 1 , wherein the sensor electronics mount is coupled to an adhesive layer, the adhesive layer configured to adhere to the skin surface of the user.
6. The method of claim 1 , wherein the analyte sensor includes a plurality of conductive pads and the transmitter housing includes a plurality of electrical contacts.
7. The method of claim 6 , wherein each of the plurality of electrical contacts is configured to self-align with a respective one of the conductive pads when the transmitter housing is coupled to the analyte sensor.
8. The method of claim 6 , wherein the plurality of conductive pads are planar.
9. The method of claim of claim 8 , wherein applying the transmitter housing to the sensor electronics mount further comprises placing each of the plurality of electrical contacts in substantial contact with the respective one of the plurality of conductive pads.
10. The method of claim 6 , wherein each of the plurality of electrical contacts includes a conductive polymer.
11. The method of claim 6 , wherein each of the plurality of electrical contacts is substantially conical shaped.
12. The method of claim 6 , wherein each of the plurality of electrical contacts includes a metal component disposed therein, wherein at least a first end of each of the plurality of electrical contacts is configured to substantially contact the respective one of the plurality of conductive pads of the analyte sensor.
13. The method of claim 12 , wherein the metal component includes one of gold or beryllium copper.
14. A method comprising:
inserting a sensor device into a sensor electronics mount, wherein the sensor electronics mount includes a spring biased retaining mechanism;
holding, by the spring biased retaining mechanism, an analyte sensor in place relative to the sensor electronics mount; and
applying a transmitter housing to the sensor electronics mount.
15. The method of claim 14 , wherein the analyte sensor includes a plurality of conductive pads and the transmitter housing includes a plurality of electrical contacts.
16. The method of claim 15 , wherein the sensor electronics mount further includes an opening to detachably couple to the transmitter housing when the analyte sensor is connected to the transmitter housing.
17. The method of claim 15 , wherein the spring biased retaining mechanism includes a plurality of clip portions.
18. The method of claim 15 , wherein the spring biased retaining mechanism is configured to bias the plurality of conductive pads toward the corresponding plurality of electrical contacts.
19. The method of claim 15 , wherein each of the plurality of electrical contacts is configured to self-align with a respective one of the conductive pads when the transmitter housing is coupled to the analyte sensor.
20. The method of claim 15 , wherein the plurality of conductive pads are planar.