IP Library Granted Patent US 10,449,658
Granted Patent B1
US 10,449,658 · App. 15/135,304 · Granted Oct 22, 2019

Methods of fabricating polycrystalline diamond elements

Inventors: Brandon Paul Linford (Draper, UT); Cody William Knuteson (Salem, UT)
Assignee: US SYNTHETIC CORPORATION
B24D3/10B24D18/0009E21B10/567
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Quick Facts
Patent No.
US 10,449,658
App. No.
15/135,304
Granted
Oct 22, 2019
Kind
B1
Abstract

Embodiments relate to polycrystalline diamond compacts (“PDCs”) including a polycrystalline diamond (“PCD”) table having a diamond grain size distribution selected for improving leachability. In an embodiment, a PDC includes a PCD table bonded to a substrate. The PCD table includes diamond grains exhibiting diamond-to-diamond bonding therebetween. The diamond grains includes a first amount being about 30 to about 65 volume % of the diamond grains and a second amount being about 18 to about 65 volume % of the diamond grains. The first amount exhibits a first average grain size of about 8 μm to about 22 μm. The second amount exhibits a second average grain size that is greater than the first average grain size and is about 15 μm to about 50 μm. Other embodiments are directed methods of forming PDCs, and various applications for such PDCs in rotary drill bits, bearing apparatuses, and wire-drawing dies.

Claims (33)

1. A method of fabricating a polycrystalline diamond element, the method comprising:

enclosing a plurality of diamond particles in a pressure transmitting medium to form a cell assembly, the plurality of diamond particles including:

a first amount being about 55 weight % to about 65 weight % of the plurality of diamond particles that exhibits a first average particle size of about 8 μm to about 14 μm; and

a second amount being about 35 weight % to about 45 weight % of the plurality of diamond particles that exhibits a second average particle size that is greater than the first average particle size and is about 20 μm to about 40 μm; and

subjecting the cell assembly to a high-pressure/high-temperature process to form a polycrystalline diamond body.

2. The method of claim 1 wherein the first average particle size is about 10 μm to about 12 μm and the second average particle size is about 18 μm to about 22 μm.

3. The method of claim 1 wherein the first amount is about 58 to about 62 weight % and the second amount is about 38 weight % to about 42 weight %.

4. The method of claim 3 wherein the first average particle size is about 10 μm to about 12 μm and the second average particle size is about 18 μm to about 22 μm.

5. The method of claim 1 wherein the first amount is about 60 weight % and the second amount is about 40 weight %, and wherein the first average particle size is about 12 μm and the second average particle size is about 20 μm.

6. The method of claim 1 wherein the plurality of diamond particles includes a third amount of about 30 weight % to about 35 weight % having a third average particle size of about 18 μm and 22 μm that is greater than the first average particle size and less than the second average particle size.

7. The method of claim 1 , further comprising mixing boron with the plurality of diamond particles in an amount greater than 0 weight % to about 5 weight %.

8. The method of claim 1 wherein the cell assembly includes a substrate positioned at least proximate to the plurality of diamond particles, and wherein subjecting the cell assembly to a high-pressure/high-temperature process to form a polycrystalline diamond body includes integrally forming the polycrystalline diamond body on the substrate.

9. The method of claim 1 further comprising at least partially leaching at least a portion of the polycrystalline diamond body.

10. A method of fabricating a polycrystalline diamond element, the method comprising:

enclosing a plurality of diamond particles in a pressure transmitting medium to form a cell assembly, the plurality of diamond particles including:

a first amount being about 55 weight % to about 65 weight % of the plurality of diamond particles that exhibits a first average particle size of about 8 μm to about 14 μm; and

a second amount being about 35 weight % to about 45 weight % of the plurality of diamond particles that exhibits a second average particle size that is greater than the first average particle size and is about 20 μm to about 40 μm;

wherein a ratio of the first average particle size to the second average particle size is about 0.3 to about 0.7; and

subjecting the cell assembly to a high-pressure/high-temperature process to form a polycrystalline diamond body.

11. A method of fabricating a polycrystalline diamond element, the method comprising:

enclosing a plurality of diamond particles in a pressure transmitting medium to form a cell assembly, wherein the plurality of diamond particles includes:

a first amount being about 30 weight % to about 65 weight % of the plurality of diamond particles that exhibits a first average particle size of about 8 μm to about 22 μm;

a second amount being about 18 weight % to about 65 weight % of the plurality of diamond particles that exhibits a second average particle size that is greater than the first average particle size and is about 15 μm to about 50 μm; and

a third amount being greater than 0 to about 40 weight % of the plurality of diamond particles that exhibits a third average particle size of about 15 μm and 22 μm that is greater than the first average particle size and less than the second average particle size; and

subjecting the cell assembly to a high-pressure/high-temperature process to form a polycrystalline diamond body.

12. The method of claim 11 wherein the first average particle size is about 10 μm to about 12 μm and the second average particle size is about 18 μm to about 22 μm.

13. The method of claim 11 wherein the first amount is about 40 to about 50 weight %, the second amount is about 30 weight % to about 36 weight %, and the third amount is about 30 weight % to about 35 weight %.

14. The method of claim 13 wherein the first average particle size is about 10 μm to about 12 μm and the second average particle size is about 18 μm to about 22 μm.

15. The method of claim 11 wherein the first average particle size is about 10 μm to about 12 μm and the second average particle size is about 35 μm to about 45 μm.

16. The method of claim 11 wherein the first amount is about 40 weight % and the first average particle size is about 12 μm.

17. The method of claim 11 further comprising mixing boron with the plurality of diamond particles in an amount greater than 0 weight % to about 5 weight %.

18. The method of claim 11 wherein the cell assembly includes a substrate positioned at least proximate to the plurality of diamond particles, and wherein subjecting the cell assembly to a high-pressure/high-temperature process to form a polycrystalline diamond body includes integrally forming the polycrystalline diamond body on the substrate.

19. The method of claim 11 further comprising at least partially leaching at least a portion of the polycrystalline diamond body.

Assignments (5)
SECURITY INTEREST Recorded Jul 18, 2025
From: US SYNTHETIC CORPORATION
To: KEYBANK NATIONAL ASSOCIATION
Reel/Frame 074973/0089 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Jul 17, 2025
From: JPMORGAN CHASE BANK, N.A.
To: CHAMPIONX LLC; APERGY ESP SYSTEMS, LLC; APERGY BMCS ACQUISITION CORP; HARBISON-FISCHER, INC.; NORRIS RODS, INC.,; NORRIS RODS, INC.,; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; US SYNTHETIC CORPORATION
Reel/Frame 072004/0019 →
RELEASE OF SECURITY INTEREST Recorded Jun 7, 2022
From: BANK OF AMERICA, N.A.
To: ACE DOWNHOLE, LLC; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; APERGY BMCS ACQUISITION CORP.; NORRISEAL-WELLMARK, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
Reel/Frame 060305/0001 →
SECURITY INTEREST Recorded Jun 5, 2020
From: ACE DOWNHOLE, LLC; APERGY BMCS ACQUISITION CORP.; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053790/0001 →
SECURITY AGREEMENT Recorded Nov 6, 2019
From: APERGY ESP SYSTEMS, LLC; APERGY BMCS ACQUISITION CORP.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; THETA OILFIELD SERVICES, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 050941/0695 →
Continuity (1)
Division 13734354 · Jan 4, 2013